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Failure Mechanisms in MEMS/NEMS Devices

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Springer Handbook of Nanotechnology

Part of the book series: Springer Handbooks ((SHB))

Abstract

The commercialization of MEMS/NEMS devices is proceeding slower than expected, because the reliability problems of microscopic components differ from macroscopically known behavior. In this chapter, we provide an overview of the state of the art in MEMS/NEMS reliability. We discuss the specific, MEMS-related problems caused by stiction due to surface forces and electric charge. Materials issues such as creep and fatigue are treated as well. Nanoscale wear is covered briefly. MEMS packaging is also discussed, because the reliability of MEMS/NEMS components critically depends on the available protection from the environment.

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Abbreviations

AFM:

atomic force microscopy

DLC:

diamond like carbon

DMD:

digital micromirror device

FEM:

finite element modeling

FFM:

friction force microscope

FIB:

focused ion beam

HF:

hydrofluoric acid

MEMS:

microelectromechanical system

MTTF:

mean time to failure

NEMS:

nanoelectromechanical system

OTS:

octadecyltrichlorosilane

RF:

radio-frequency

SAM:

scanning acoustic microscopy

SAM:

self-assembled monolayer

SEM:

scanning electron microscopy

SFA:

surface force apparatus

SPM:

scanning probe microscopy

TEM:

transmission electron microscopy

TV:

television

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Authors and Affiliations

  1. Kamerlingh Onnes Laboratory, Leiden University, Niels Bohrweg 2, 2333, Leiden, CA, The Netherlands

    W. Spengen Ph.D.

  2. MCP/REMO, Interuniversity Microelectronics Center (IMEC), Kapeldreef 75, 3001, Leuven, Belgium

    Robert Modlinski Ph.D.

  3. ESAT/MICAS, Katholieke Universiteit Leuven, Kasteelpark, Arenberg 10, 3001, Leuven, Belgium

    Robert Puers Prof.

  4. Interuniversity Microelectronics Center (IMEC), Kapeldreef, 75, 3001, Leuven, Belgium

    Anne Jourdain Ph.D.

Authors
  1. W. Spengen Ph.D.
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  2. Robert Modlinski Ph.D.
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  3. Robert Puers Prof.
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  4. Anne Jourdain Ph.D.
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Corresponding authors

Correspondence to W. Spengen Ph.D. , Robert Modlinski Ph.D. , Robert Puers Prof. or Anne Jourdain Ph.D. .

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Editors and Affiliations

  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM), Ohio State University, 201 W. 19th Avenue, W 390 Scott Laboratory, Ohio 43210-1142, Columbus, OH, USA

    Bharat Bhushan Prof.

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Spengen, W., Modlinski, R., Puers, R., Jourdain, A. (2007). Failure Mechanisms in MEMS/NEMS Devices. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-29857-1_52

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