Abstract
The paper considers the features of the numerical simulation of a thin plate under the thermal shock in the ANSYS package. The temperature fields of one-layer and three-layer plates are investigated. Their comparative analysis is carried out. The features of the results obtained are identified and explained using various models. The presented results can be used to simulate the thermal shock of a thin plate using the ANSYS package.
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Acknowledgments
The work was carried out within the framework of the project «Development of scientific and technical foundations and design solutions that ensure the implementation of the required level of microaccelerations on board small spacecraft» (No. 22–19-00483).
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Orlov, D., Serdakova, V., Evtushenko, M., Khnyryova, E., Nikolaeva, A. (2023). Investigating the Features of Various Plate Models Under the Thermal Shock in the ANSYS Package. In: Beskopylny, A., Shamtsyan, M., Artiukh, V. (eds) XV International Scientific Conference “INTERAGROMASH 2022”. INTERAGROMASH 2022. Lecture Notes in Networks and Systems, vol 574. Springer, Cham. https://doi.org/10.1007/978-3-031-21432-5_340
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DOI: https://doi.org/10.1007/978-3-031-21432-5_340
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