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Heatsink diamond nanostructures for microwave semiconductor electronics

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Abstract

A basic technique for manufacturing and processing polycrystalline diamond as a promising material for heatsinks of high-power microwave semiconductor devices is proposed. The fabrication of polycrystalline diamond wafers by chemical vapor deposition is investigated. The choice of a method for fragmenting polycrystalline diamond wafers is considered and a new technique for low-pressure laser/plasma chemical cutting of wafers in a gaseous medium is proposed which consists of growing polycrystalline diamond on preshaped silicon substrates and subsequent silicon etching.

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Correspondence to I. A. Glinskiy.

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Original Russian Text © P.P. Maltsev, S.V. Redkin, I.A. Glinskiy, N.V. Poboikina, M.P. Duknovskiy, Yu.Yu. Fedorov, A.K. Smirnova, E.N. Kulikov, S.V. Shcherbakov, I.A. Leontiev, O.Yu. Kudryashov, A.S. Skripnichenko, 2016, published in Rossiiskie Nanotekhnologii, 2016, Vol. 11, Nos. 7–8.

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Maltsev, P.P., Redkin, S.V., Glinskiy, I.A. et al. Heatsink diamond nanostructures for microwave semiconductor electronics. Nanotechnol Russia 11, 480–490 (2016). https://doi.org/10.1134/S199507801604011X

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  • DOI: https://doi.org/10.1134/S199507801604011X

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