Abstract
The interaction between solid copper and liquid gallium is considered, which is the main process during the setting of diffusion-solidifying solders. The dependences of the process rate and the size characteristics on the phase composition of the initial mixture are found. The intermetallic compound CuGa2 is shown to be the product of the interaction in all cases.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
O. I. Tikhomirova, M. V. Pikunov, I. D. Marchukova, et al., “Structural Transformations during Solidification of Copper-Gallium Alloys,” Fiz. Khim. Mekh. Materials 5(4), 455–458 (1969).
O. I. Tikhomirova, L. P. Ruzinov, M. V. Pikunov, and I. D. Marchukova, “Interdiffusion in the Gallium-Copper System,” Fiz. Met. Metalloved. 29(4), 796–802 (1970).
A. I. Ancharov, A. Yu. Manakov, N. A. Mezentsev, et al., “New Station at 4th Beamline of the VEPP-3 Storage Ring,” Nucl. Instruments and Methods Phys. Res. A 470, 80–83 (2001).
A. P. Savitskii, Liquid-Phase Sintering of Systems with Interacting Components (Nauka, Novosibirsk, 1991) [in Russian].
A. P. Savitskii, “Diffusion Mechanism of Occurrence of the Brittleness under Action of Liquid Metals,” Izv. Vyssh. Uchebn. Zaved., Fiz., No. 6, 56–62 (1972).
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © A.I. Ancharov, T.F. Grigoryeva, A.P. Barinova, V.V. Boldyrev, 2008, published in Metally, 2008, No. 6, pp. 33–38.
Rights and permissions
About this article
Cite this article
Ancharov, A.I., Grigoryeva, T.F., Barinova, A.P. et al. Interaction between copper and gallium. Russ. Metall. 2008, 475–479 (2008). https://doi.org/10.1134/S0036029508060049
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S0036029508060049