Abstract
Two-dimensional (2D) boron nitride nanosheets (BNNS), with exceptional thermoconductive properties and wide band gap, hold a great promise as candidate fillers for the preparation of the functional dielectric composites. However, the unsatisfactory dispersity in solvents and poor interfacial compatibility with the polymer matrix are still a great baffle for its practical applications. In the present study, we show that non-covalent functionalization of BNNS via polyvinylpyrrolidone (PVP) is a facile approach to optimizing their surface characteristics and facilitating the preparation of hybrid composites. The PVP functionalized BNNS (BNNS@PVP) can be dispersed stably in the aqueous solution for over 2 weeks. Composite films with ultrahigh thermal conductivity (~ 14.5 W m−1 K−1) are achieved solely by mixing with BNNS@PVP and one-dimensional (1D) aramid nanofibers (ANFs). Additionally, strong interfacial interactions are constructed between BNNS@PVP and ANFs, which further enables efficient stress transfer and charge dissipation through the 1D/2D configuration, contributing to outstanding tensile strength (~ 184 MPa) and high electric breakdown strength (~ 274 kV mm−1) for composite films. All these results demonstrate that surface modification of BNNS is a powerful tool for developing functional materials with multipurpose applications, including thermal management and high-voltage insulation.
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We appreciate the financial support from the National Natural Science Foundation of China (52107020, 52377028, 52301192, 52377026), the Key R & D project of Sichuan Province (2023YFG0236), the State Key Laboratory of Electrical Insulation and Power Equipment (EIPE23210), and the Postdoctoral Science Foundation of China (2018M643475).
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Junwen Ren: conceptualization, investigation, formal analysis, methodology, writing—original draft, writing—review and editing. Guoqing Jiang: data curation, investigation, methodology. Zi Wang: investigation, methodology. Qiuwanyu Qing: formal analysis. Fuli Teng and Guanglei Wu: formal analysis. Zirui Jia and Shenli Jia: formal analysis, writing—review and editing.
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Ren, J., Jiang, G., Wang, Z. et al. Highly thermoconductive and mechanically robust boron nitride/aramid composite dielectric films from non-covalent interfacial engineering. Adv Compos Hybrid Mater 7, 5 (2024). https://doi.org/10.1007/s42114-023-00816-z
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DOI: https://doi.org/10.1007/s42114-023-00816-z