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A review of microencapsulated thermochromic coatings for sustainable building applications

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Abstract

The review covers microencapsulation methods for encapsulating thermochromic leuco dyes, and the incorporation of these microencapsulated thermochromic dyes in smart coatings has been developed, which helps in creating sustainable buildings that use less power for heating and cooling applications. The thermochromic mechanism of leuco dye developer–solvent systems has been elaborated, and the role of each component for the functioning of thermochromic dyes is discussed. The future scope of these dyes in applications involving smart windows and smart coatings for sustainable buildings is consolidated, and their impact on energy consumption has been studied.

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Acknowledgments

The authors would like to thank Dr. C. P. Ramanarayanan, Vice-Chancellor of DIAT (DU), Pune, and Prof. S. T. Mhaske, Head of Department of Polymer and Surface Engineering, ICT Mumbai, for constant encouragement and support. The authors would also like to acknowledge Mr. Swaroop Gharde, Mr. Prakash Gore, Mr. Jay Korde, Mr. Nihar Sakhadeo, Mr. Nikhil Patil, Mr. Shivanand Aklujkar, and Mrs. Uma Aklujkar for technical discussion and support. The authors are thankful to all anonymous Reviewers and the Editor for improving the quality of the revised manuscript by their valuable suggestions and comments.

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  1. Department of Polymer and Surface Engineering, Institute of Chemical Technology, Mumbai, Maharashtra, 400019, India

    Pritish Shivanand Aklujkar

  2. Nano Surface Texturing Laboratory, Department of Metallurgical and Materials Engineering, Defence Institute of Advanced Technology (DU), Ministry of Defence, Girinagar, Pune, Maharashtra, 411025, India

    Balasubramanian Kandasubramanian

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  1. Pritish Shivanand Aklujkar
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  2. Balasubramanian Kandasubramanian
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Correspondence to Balasubramanian Kandasubramanian.

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Aklujkar, P.S., Kandasubramanian, B. A review of microencapsulated thermochromic coatings for sustainable building applications. J Coat Technol Res 18, 19–37 (2021). https://doi.org/10.1007/s11998-020-00396-3

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  • DOI: https://doi.org/10.1007/s11998-020-00396-3

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