Abstract
In this paper, the electrochemical reaction mechanism is used to develop a mathematical model for an electroless nickel plating process of plated-through-hole board. The model is calibrated against experimental data and the result, which is in good agreement with measured data, applied for state estimation of the unobservable processes. The electrical, chemical, and board parameters are estimated from measurements that are standard in the nickel plating industry.
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Tenno, R., Kantola, K. & Tenno, A. Electroless nickel plating process model for plated-through-hole board manufacturing. J. Electron. Mater. 35, 1825–1836 (2006). https://doi.org/10.1007/s11664-006-0164-3
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DOI: https://doi.org/10.1007/s11664-006-0164-3