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Effect of Temperature on the Structure and Properties of Fine-Grain Copper Foil

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Metal Science and Heat Treatment Aims and scope

The structure and mechanical properties of different-thickness copper foils obtained by chemical and electrochemical deposition at high and low temperatures are studied. The activation energy and the driving force of the recrystallization are determined.

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References

  1. A. S. Kozyrev and G. V. Mylov, Printed-Circuit Boards: Selection of Base Materials [in Russian], Izd. Goryachaya Liniya – Telekom (2015), 176 p.

  2. S. V. Ivanov and N. I. Kotlyarenko, “Advanced materials for making hybrid multilayer printed-circuit boards,” in: Proc. Int. Symp. “Reliability and Quality” [in Russian] (2012), Vol. 2, pp. 211 – 212.

  3. B. N. Smirnov and M. L. Khazin, Foil for Printed-Circuit Boards [in Russian], UrO RAN, Ekaterinburg (2003), 376 p.

  4. N. Kosarev, M. Khazin, and R. A. Apakashev, “Mechanical properties of micro- and nanostructured copper films,” J. Mater. Sci. Chem. Eng., 1(5), 7 – 10 (2013).

    CAS  Google Scholar 

  5. D. Brandon and W. Kaplan, Microstructure of Materials. Methods of Investigation and Control [in Russian], Tekhnosfera, Moscow (2004). 284 p.

  6. Y. R. Cho, Y. S. Lee, and S. K. Rha, “Electroless plated copper thin film for metallization of printed circuit board: Neutral process,” Korean J. Mater. Res., 23(11), 61 – 665 (2013).

    Article  Google Scholar 

  7. T. K. Jung, S. Y. Lee, and T. V. Kim, “Tensile behavior of rolled and annealed copper thin foils,” Appl. Mech. Mater. Trans. Tech. Publ., 152, 151 – 155 (2012).

    Article  Google Scholar 

  8. J. Zhu, J. Feng, and Z. Guo, “Mechanical properties of commercial copper current-collector foils,” RSC Adv., 4(101), 57671 – 57678 (2014).

    Article  CAS  Google Scholar 

  9. N. Murata and N. Saito, “Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections,” in: Electronic Components and Technology Conf., IEEE 61st (2011), pp. 2119 – 2125.

  10. P. I. Polukhin, S. S. Gorelik, and V. K. Vorontsov, The Physical Fundamentals of Plastic Deformation [in Russian], Metallurgiya, Moscow (1982), 584 p.

  11. N. R. Overman, S. T. Overman, and D. J. Edwards, “Mechanical property anisotropy in ultra-thick copper electrodeposits,” Appl. Phys., 120(3), 1181 – 1187 (2015).

    Article  CAS  Google Scholar 

  12. T. Sharma, R. Bruning, and T. Nguyen, “Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness,” Microelectr. Eng., 140, 38 – 46 (2015).

    Article  CAS  Google Scholar 

  13. A. I. Ustinov, “Structure and mechanical properties of nanostructured vacuum nickel condensates,” Nanosist., Nanomater., Nanotekhnol., 10(1), 11 – 18 (2012).

  14. F. Hessner, H. P. Schtuwe, R. D. Doherty, et al., Recrystallization of Metallic Materials [Russian translation], Metallurgiya, Moscow (1982), 352 p.

  15. Osintsev and V. N. Fedorov, Copper and Copper Alloys. Domestic and Foreign Grades [in Russian], Mashinostroenie, Moscow (2004), 215 p.

  16. V. V. Povetkin, I. M. Kovenskii, and Yu. M. Ustinovshchikov, Structure and Properties of Electrolytic Alloys [in Russian], Nauka, Moscow (1992), 245 p.

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Authors and Affiliations

  1. Ural State Mining University, Ekaterinburg, Russia

    R. A. Apakashev, M. L. Khazin & N. G. Valiev

Authors
  1. R. A. Apakashev
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  2. M. L. Khazin
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  3. N. G. Valiev
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Correspondence to R. A. Apakashev.

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Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 12, pp. 42 – 46, December, 2019.

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Apakashev, R.A., Khazin, M.L. & Valiev, N.G. Effect of Temperature on the Structure and Properties of Fine-Grain Copper Foil. Met Sci Heat Treat 61, 787–791 (2020). https://doi.org/10.1007/s11041-020-00501-8

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  • DOI: https://doi.org/10.1007/s11041-020-00501-8

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