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Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards

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Abstract

In the processing technology of printed circuit boards, the common electroless copper plating technology of ethylenediaminetetraacetic acid disodium (EDTA-2Na) has the problems of large surface stress, uneven crystal particles, and large surface roughness of the copper plating layer. To remedy the above shortcomings and meet the current requirements for copper interconnects in printed circuit boards (PCBs), the present study has investigated a chemical copper plating system that combines a high deposition rate with low stress. An electroless copper plating was then performed on a polyacrylonitrile-butadiene-styrene (ABS) plastic resin plate with 2,6-diaminopyridine (2,6-DAP), 2,2-bipyridine, sodium hydroxyethyl sulfonate (SHES) and NiSO4·6H2O as supplementary additives. By using scanning electron microscopy (SEM), electrochemical, atomic force microscopy (AFM), and X-ray diffraction (XRD) analyses, it has been shown that the average surface roughness Ra became reduced from 202 nm to 76.1 nm when using additives in the chemical copper plating process. Also, the internal stresses of the deposited copper layer on the (220) and (311) planes of a crystalline copper layer decreased from − 70.48 and − 53.03 to − 27.31 and − 27.16 MPa, respectively. The composite additive improved the quality of the copper layer of the EDTA-2Na-based chemical copper plating system, increasing the practical range of industrial applications and facilitating the subsequent application of higher-precision processing.

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Data availability

The datasets generated during and/or analyzed during the current study are not publicly available, but are available from the corresponding author on reasonable request.

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Acknowledgements

Acknowledgement is made to Edit Springs ( https://www.editsprings.cn ) for providing professional language services.

Funding

The authors gratefully acknowledge the support of National Natural Science Foundation of China (21561027), Natural Science Foundation of Ningxia (2020AAC03266 & 2022AAC03298 & 2023AAC03340 & 2023AAC03326), Innovation and Entrepreneurship Project for Returnees of Ningxia ( Ning Renshe Letter [2024] No. 4), Science and Technology Innovation Leading Talent Project of Ningxia (KJT2016004), Ningxia New University Think Tank Project ([2018] 12), Liupanshan Resources Engineering and Technology Research Center (HGZD22-18 & HGZD23-09), Key Research Project of Ningxia Normal University (XJZDD2321), Key Discipline of Inorganic Chemistry ([2017] 83).

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Author notes

  1. Xinwei Li and Wenxia Zhao have contributed equally to this work.

Authors and Affiliations

  1. College of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan, 756000, China

    Xinwei Li, Wenxia Zhao, Xin Liu, Kaihong Hui, Wei Zhao, Yifan Song, Qian Zhu & Huaijun Chen

  2. Key Laboratory of Green Catalytic Materials and Technologies, Guyuan, 756000, Ningxia Hui Autonomous Region, China

    Xinwei Li, Wenxia Zhao, Xin Liu, Kaihong Hui, Wei Zhao, Yifan Song, Qian Zhu & Huaijun Chen

  3. Sheqi County No. 1 Senior High School, Nanyang, 473300, China

    Yi Cheng

  4. Dezhou No.2 Middle School, Dezhou, 253000, China

    Yubo Cui

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  1. Xinwei Li
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Contributions

Xinwei Li (First Author): Conceptualization, Methodology, Software, Investigation, Formal Analysis, Writing-Original Draft; Wenxia Zhao (Corresponding Author): Conceptualization, Funding Acquisition, Resources, Supervision, Writing-Review and Editing; Yi Cheng: Data Curation, Writing-Original Draft; Xin Liu: Visualization, Investigation; Kaihong Hui and Wei Zhao: Resources, Supervision; Yifan Song and Qian Zhu: Software, Validation; Huaijun Chen and Yubo Cui: Visualization, Editing.

Corresponding author

Correspondence to Wenxia Zhao.

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Li, X., Zhao, W., Cheng, Y. et al. Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards. J Mater Sci: Mater Electron 35, 484 (2024). https://doi.org/10.1007/s10854-024-12283-3

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