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Review of ultrasonic-assisted soldering in Sn-based solder alloys

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Abstract

Sn-based lead-free solder has been widely applied in areas like electronic packaging due to its excellent solderability. The composite solders can be obtained by mixing additional elements in the Sn alloy, including Sn–Cu, Sn–Zn, Sn–Ag, and Sn–Bi solder. Combined with different technologies, various requirements for connection can be met. The Ultrasonic-assisted collection has the ability to optimize the structure and performance of joints due to its unique cavitation effect, which is mainly used in the field of brazing. Behalf of improving the performance of connectors, ultrasonic technology has been gradually introduced into soldering gradually. Based on the latest research of ultrasonic-assisted soldering in Sn-based solder joints, it is the application of different Sn-based solder that is taken as the starting point in this paper. The processing of ultrasonic-assisted soldering is summarized for the analytical or evaluative account of different research outcomes, and the factors affecting the performance of solder joints caused by ultrasound are analyzed and discussed. Besides, some suggestions are put forward, which may provide a reference for future application and development hopefully.

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The authors declare that all data supporting the findings of this study are available within the article.

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Funding

This work was financially supported by the Natural Science Foundation of Jiansu Province (Grant No. BK20211351).

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Authors and Affiliations

  1. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Chen Chen, Xi Wang & Xiao Lu

  2. School of Materials Science and Engineering, Xiamen University of Technology, Xiamen, 361024, China

    Liang Zhang

  3. Shanghai Institute of Radio Equipment, Shanghai, 200090, China

    Li-li Gao & Meng Zhao

  4. State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China

    Su-juan Zhong

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  1. Chen Chen
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Contributions

CC contributed to data curation, methodology, writing original draft preparation and editing; LZ contributed to corresponding author, data curation, reviewing and editing; XW contributed to reviewing and investigating, supervision, check grammar; XL contributed to investigating, validation; LG contributed to investigating, check grammar; MZ contributed to investigating; SZ contributed to investigating.

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Correspondence to Liang Zhang.

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Chen, C., Zhang, L., Wang, X. et al. Review of ultrasonic-assisted soldering in Sn-based solder alloys. J Mater Sci: Mater Electron 34, 656 (2023). https://doi.org/10.1007/s10854-023-10063-z

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