Abstract
With the innovation of electronics industry and the advancement in 5G technology, the overheating problem has become an urgent obstacle to further realize the high performance and multi-function of electronic devices. Thus, it is essential to develop efficient thermal management materials to realize timely and effective heat dissipation. The thermal management systems based on phase change materials (PCMs) have received extensive attention in recent years. In this work, composite PCMs with a high phase change enthalpy of 149.56 J g−1, multiple phase change characteristics, a high thermal conductivity of 1.28 Wm−1 K−1, and excellent shape stability were fabricated by the means of cross-linked polymer swelling strategy. When the as-prepared composite PCMs were directly attached to the heating plate or served as thermal interface materials (TIMs) to dissipate heat, the temperature of heating plate can be reduced by 5.8 °C and 18.8 °C, respectively, revealing great potential in the thermal management application of electronic devices.
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Acknowledgements
This research was funded by the Special Project of the State Tobacco Monopoly Administration (Grant No. 1102021001021) and the National Natural Science Foundation of China (Grant No. 52003170). The authors thank New Tobacco Products Engineering and Technology Research Center of Sichuan Province. (Grant No. JL/SCZYG SJ001-03)
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Han, DL., Yang, LY., Wang, SP. et al. Thermally conductive composite phase change materials with excellent thermal management capability for electronic devices. J Mater Sci: Mater Electron 33, 1008–1020 (2022). https://doi.org/10.1007/s10854-021-07371-7
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DOI: https://doi.org/10.1007/s10854-021-07371-7