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Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

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Abstract

This study investigates the effect of the composite addition of Al and Cu on the microstructure, physical properties, wettability, and corrosion properties of Sn–20Bi solder alloy. Scanning electron microscopy and X-ray diffraction were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn–20Bi–x (x = 0, 0.1 wt% Al, 0.5 wt% Cu, and 0.1 wt% Al–0.5 wt% Cu) alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that the alloy with 0.1 wt% Al produces the largest dendrite and the composite addition of 0.1 wt% Al and 0.5 wt% Cu formed Cu6Sn5 and CuAl2 intermetallic compounds in the alloy structure. And the electrical conductivity of Sn–20Bi–0.1Al is the best, which reaches 5.32 MS/m. The spread area of the solder alloy is reduced by the addition of 0.1 wt% Al and 0.5 wt% Cu, which is 80.7 mm2. The corrosion products of Sn–20Bi–x solder alloys are mainly lamellar Sn3O(OH)2Cl2 and the corrosion resistance of 0.1 wt% Al solder alloy alone is the best. The overall corrosion resistance of Sn–20Bi–0.1Al–0.5Cu is weakened and the corrosion of solder alloy is not uniform.

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Acknowledgements

This research work is supported by the Guangxi Natural Science Foundation (2020GXNSFBA297062, 2018GXNSFDA050008, 2020GXNSFAA159093), the National Natural Science Foundation of China (51761002), the Training Plan of High-Level Talents of Guangxi University (XMPZ160714), and the Scientific Research Projects of the General Administration of Customs (2020HK256).

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Authors and Affiliations

  1. School of Resources, Environment and Materials, Guangxi University, Nanning, 530004, Guangxi, People’s Republic of China

    Weiou Qin, Jidong Li, Shiwei Jiang, Wenchao Yang & Yongzhong Zhan

  2. Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning, 530004, Guangxi, People’s Republic of China

    Weiou Qin, Jidong Li, Shiwei Jiang, Wenchao Yang & Yongzhong Zhan

  3. The Testing and Technology Center for Industrial Products, Shenzhen Customs, Shenzhen, 518067, People’s Republic of China

    Qiang Zhang & Junli Feng

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  1. Weiou Qin
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Correspondence to Wenchao Yang or Yongzhong Zhan.

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Qin, W., Li, J., Zhang, Q. et al. Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy. J Mater Sci: Mater Electron 33, 177–189 (2022). https://doi.org/10.1007/s10854-021-07283-6

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