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Investigation of light extraction from light emitting module chip-on-board

  • Special Section: The 9th International Conference on Optics-photonics Design & Fabrication “ODF’14, Itabashi, Tokyo”
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Abstract

A research has been carried out on the optimization of the shape of encapsulating cover to minimize optical losses in light-emitting modules fabricated with the “chip-on-board” (COB) technology. Optical properties of the components of a typical COB were taken into account including those of the substrate, light-emitting chips, encapsulating material and phosphor particles. Light losses were analyzed for various types of encapsulant surface structuring in an attempt to design an optical element with maximum light extraction efficiency. Calculations were complemented with experimental measurements. The results of the research showed that structuring the surface of the encapsulant can enhance light extraction by 10 to 15% for the material without phosphor particles and by 10 to 14% for the material with phosphor particles.

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Authors and Affiliations

  1. ITMO University, Kronverkskiy 49, Saint-Petersburg, 197101, Russia

    Svetlana Lipnitskaya, Karim Mynbaev, Vladislav Bougrov, Alexey Kovsh, Maxim Odnoblyudov & Alexey Romanov

  2. Optogan Group, Tallinskoe 206, Saint-Petersburg, 198205, Russia

    Svetlana Lipnitskaya, Karim Mynbaev, Lidiya Nikulina, Vladimir Kramnik, Vladislav Bougrov, Alexey Kovsh, Maxim Odnoblyudov & Alexey Romanov

  3. Ioffe Institute, Polytechnicheskaya 26, Saint-Petersburg, 194021, Russia

    Karim Mynbaev & Alexey Romanov

Authors
  1. Svetlana Lipnitskaya
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  2. Karim Mynbaev
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  3. Lidiya Nikulina
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  4. Vladimir Kramnik
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  5. Vladislav Bougrov
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  6. Alexey Kovsh
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  7. Maxim Odnoblyudov
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  8. Alexey Romanov
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Correspondence to Karim Mynbaev.

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Lipnitskaya, S., Mynbaev, K., Nikulina, L. et al. Investigation of light extraction from light emitting module chip-on-board. OPT REV 21, 655–658 (2014). https://doi.org/10.1007/s10043-014-0105-y

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  • DOI: https://doi.org/10.1007/s10043-014-0105-y

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