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Optical Design: Chip and Packaging

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Handbook of Advanced Lighting Technology

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Abstract

Light-emitting diode (LED) has been extensively applied to general lighting since the luminous efficacy exceeded 100 lm/W. In addition to high energy efficiency, the advantages of fast response, wide color range, narrow bandwidth, compact size, and environmental benefits extend the application of LED to display, communication, and others (Sun et al. 2004; Zukauskas et al. 2002; Schubert and Kim 2005). In regard to a light source with the use of an LED in lighting application, three properties related to the optical property should be addressed. The first is the optical efficiency, the second is the light pattern distribution, and the third is the color consistency. All these three properties can be determined in the chip level, the packaging level, and also the luminaire level. The chip level and the packaging level take the majority to determine the most properties of an LED luminaire. Among these properties, chip-level optics is especially important in intrinsic energy efficiency of an LED. In contrast, the packaging design is more important in color performance, especially for a phosphor-converted white LED (so-called pcW-LED). In addition, the optical pattern and energy efficiency are two important factors determined in this level.

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Authors and Affiliations

  1. Department of Optics and Photonics/Institute of Lighting and Display Sciences, National Central University, Jhongli, Taiwan

    Ching-Cherng Sun

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  1. Ching-Cherng Sun
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Correspondence to Ching-Cherng Sun .

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Editors and Affiliations

  1. Smart Lighting Engineering Center, Rensselaer Polytechnic Institute, Troy, New York, USA

    Robert Karlicek

  2. Department of Optics and Photonics, National Central University, Jhongli, Taiwan

    Ching-Cherng Sun

  3. Toulouse University, Toulouse, France

    Georges Zissis

  4. OLED Lighting, Universal Display Corporation, Ewing, USA

    Ruiqing Ma

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© 2014 Springer International Publishing Switzerland

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Sun, CC. (2014). Optical Design: Chip and Packaging. In: Karlicek, R., Sun, CC., Zissis, G., Ma, R. (eds) Handbook of Advanced Lighting Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-00295-8_17-1

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  • DOI: https://doi.org/10.1007/978-3-319-00295-8_17-1

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  • Publisher Name: Springer, Cham

  • Online ISBN: 978-3-319-00295-8

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