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Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system

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Abstract

Results of heat transfer testing of heat absorption modules (HAM), heat rejection modules (HRM), and a recirculating-liquid cooling system are reported. Low-profile, Cu-based, microchannel heat exchangers (MHEs) were fabricated and used as the HAM as well as components for assembly of a microchannel HRM. Detailed experimental assessment of two different liquid-passing HRMs and a microchannel-based recirculating-liquid cooling system was carried out, and benchmarked against all-solid devices of the same geometric dimensions. Incorporating microchannel liquid flow through each fin, the device-level heat transfer performance of the microchannel HRM was improved by up to ~50%. Detailed testing of a microchannel-based recirculating-liquid cooling system indicate that low-profile Cu MHEs are highly effective in heat flux removal while having a small area/volume footprint, and that enhancing the HRM performance is critical to boosting the overall performance of such recirculating-liquid cooling systems.

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Acknowledgments

The authors gratefully acknowledge partial project support from NSF through grants CMMI-0556100, CMMI-0900167, and IIP-1058523 and Louisiana State Board of Regents through contracts LEQSF(2011-13)-RD-B-03 and LEQSF(2011-13)-RD-B-04. Helpful discussions with Prof. G.B. Sinclair is acknowledged with thanks.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA, 70803, USA

    Bin Lu & W. J. Meng

  2. Enervana Technologies LLC, Baton Rouge, LA, 70820, USA

    Fanghua Mei

Authors
  1. Bin Lu
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  2. W. J. Meng
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  3. Fanghua Mei
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Correspondence to W. J. Meng.

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Lu, B., Meng, W.J. & Mei, F. Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system. Microsyst Technol 18, 341–352 (2012). https://doi.org/10.1007/s00542-011-1397-5

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  • DOI: https://doi.org/10.1007/s00542-011-1397-5

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