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An Efficient Micro-Bolometer Design for Temperature Measurement

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Emerging Technologies in Electrical Engineering for Reliable Green Intelligence (ICSTACE 2023)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 1117))

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Abstract

The article describes the design of a micro-bolometer for temperature measurement applications. The design of micro-bolometer includes material selection for chip, packaging, and substrate, and micromachining process for micro-bolometer fabrication and wafer-level hermetic sealing processes for packaging. The packaging of micro-bolometer plays a crucial role in its performance, so it was given importance while designing. Wafer-to-wafer bonding was applied in order to provide hermetic sealing-based packaging. Solidworks was used for solid modeling.

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References

  1. Voshell A, Dhar N, Rana MM (2017) Materials for microbolometers: vanadium oxide or silicon derivatives. In: Dhar NK, Dutta AK (eds) Anaheim, California, United States; [cited 2021 Nov 3]. p 102090M. Available http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=https://doi.org/10.1117/12.2263999

  2. Darling RB, Iwanaga S (2009) Structure, properties, and MEMS and microelectronic applications of vanadium oxides. Sadhana [Internet]. [cited 2021 Nov 1];34(4):531–542. Available http://link.springer.com/https://doi.org/10.1007/s12046-009-0025x

  3. Mottin E, Bain A, Martin J-L, Ouvrier-Buffet J-L, Bisotto S, Yon J-J, et al (2003) Uncooled amorphous silicon technology enhancement for 25-μm pixel pitch achievement. In: Andresen B, Fulop GF, Strojnik M (eds) Seattle, WA; [cited 2021 Nov 2]. p 200. Available http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=https://doi.org/10.1117/12.464848

  4. Chu C, Liao X, Yan H, Yi Z (2019) RF MEMS thermistor power sensor based on wheatstone full-bridge structure. In: 2019 IEEE 32nd international conference on micro electro mechanical systems (MEMS) [Internet]. Seoul, Korea (South): IEEE; [cited 2021 Nov 2]. pp 891–894. Available https://ieeexplore.ieee.org/document/8870858/

  5. Rumfelt AY, Elwell LB. Radio frequency power measurements. Proc IEEE [Internet]. 1967 [cited 2021 Nov 20];55(6):837–850. Available http://ieeexplore.ieee.org/document/1447627/

  6. Wise KD (2007) Integrated sensors, MEMS, and microsystems: reflections on a fantastic voyage. Sens Actuators Phys [Internet]. [cited 2021 Nov 8];136(1):39–50. Available https://linkinghub.elsevier.com/retrieve/pii/S0924424707000611

  7. Hsieh CT, Jyh-Ming Ting, Yang C, Chung CK (2002) The introduction of MEMS packaging technology. In: Proceedings of the 4th international symposium on electronic materials and packaging, [Internet]. Kaohsiung, Taiwan: IEEE; 2002 [cited 2021 Nov 2]. pp 300–306. Available http://ieeexplore.ieee.org/document/1188855/

  8. Niklaus F, Pejnefors J, Dainese M, Haggblad M, Hellstrom P-E, Wallgren UJ, et al (2004) Characterization of transfer-bonded silicon bolometer arrays. In: Andresen BF, Fulop GF (eds) Orlando, FL; [cited 2021 Nov 4]. p 521. Available http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=https://doi.org/10.1117/12.565894

  9. Smith EM, Ginn JC, Warren AP, Long CJ, Panjwani D, Peale RE, et al (2014) Linear bolometer array using a high TCR VOx-Au film. In: Andresen BF, Fulop GF, Hanson CM, Norton PR (eds) Baltimore, Maryland, USA; [cited 2021 Nov 4]. p 90701Z. Available http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=https://doi.org/10.1117/12.2050434

  10. Niklaus F, Vieider C, Jakobsen H (2007) MEMS-based uncooled infrared bolometer arrays: a review. In: Chiao J-C, Chen X, Zhou Z, Li X (eds) Beijing, China; [cited 2021 Nov 3]. p 68360D. Available http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=https://doi.org/10.1117/12.755128

  11. Toos SI, Moradi G, Ebrahimi A (2019) MEMS packaging review. [cited 2021 Nov 3]; Available http://rgdoi.net/https://doi.org/10.13140/RG.2.2.17074.35522

  12. Hao Y, Yuan W, Xie J, Chang H (2016) A novel packaging stress isolation structure for SOI based MEMS gyroscopes. In: 2016 IEEE sensors [Internet]. Orlando, FL, USA: IEEE; [cited 2021 Nov 3]. pp 1–3. Available http://ieeexplore.ieee.org/document/7808649/

  13. Rahman MS. Reliability of advanced dielectrics in gate oxide and device level packaging in MEMS. 146

    Google Scholar 

  14. Baets R, Subramanian AZ, Clemmen S, Kuyken B, Bienstman P, Le Thomas N, et al (2016) Silicon photonics: silicon nitride versus silicon-on-insulator. In: Optical fiber communication conference [Internet]. Anaheim, California: OSA; [cited 2021 Nov 8]. p Th3J.1. Available https://www.osapublishing.org/abstract.cfm?URI=OFC-2016-Th3J.1

  15. Blumenthal DJ, Heideman R, Geuzebroek D, Leinse A, Roeloffzen C (2018) Silicon nitride in silicon photonics. Proc IEEE [Internet]. [cited 2021 Nov 8];106(12):2209–2231. Available https://ieeexplore.ieee.org/document/8472140/

  16. Kovacs GTA, Maluf NI, Petersen KE (1998) Bulk micromachining of silicon. Proc IEEE [Internet]. [cited 2021 Nov 16];86(8):1536–1551. Available http://ieeexplore.ieee.org/document/704259/

  17. Bustillo JM, Howe RT, Muller RS (1998). Surface micromachining for microelectromechanical systems. Proc IEEE [Internet]. [cited 2021 Nov 16]; 86(8):1552–1574. Available http://ieeexplore.ieee.org/document/704260/

  18. Gianchandani Y, Najafi K (1991) A bulk silicon dissolved wafer process for microelectromechanical systems. In: International electron devices meeting 1991 [Technical Digest] [Internet]. Washington, DC, USA: IEEE; [cited 2021 Nov 16]. pp 757–760. Available http://ieeexplore.ieee.org/document/235313/

  19. Becker EW, Ehrfeld W, Hagmann P, Maner A, Münchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron Eng [Internet]. [cited 2021 Nov 16];4(1):35–56. Available https://linkinghub.elsevier.com/retrieve/pii/0167931786900043

  20. Torunbalci MM, Alper SE, Akin T (2015) Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding. Sens Actuators Phys [Internet]. [cited 2021 Nov 26];224:169–176. Available https://linkinghub.elsevier.com/retrieve/pii/S0924424715000436

  21. Cao Y, Ning W, Luo L (2009) Wafer-level package with simultaneous TSV connection and cavity hermetic sealing by solder bonding for MEMS device. IEEE Trans Electron Packag Manuf [Internet]. [cited 2021 Nov 26];32(3):125–132. Available http://ieeexplore.ieee.org/document/5032049/

  22. Soon JBW, Singh N, Calayir E, Fedder GK, Piazza G (2016) Hermetic wafer level thin film packaging for MEMS. In: 2016 IEEE 66th electronic components and technology conference (ECTC) [Internet]. Las Vegas, NV, USA: IEEE; [cited 2021 Nov 26]. pp 857–862. Available http://ieeexplore.ieee.org/document/7545528/

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Authors and Affiliations

  1. Sardar Vallabhbhai National Institute of Technology, Surat, India

    Shubham Devang Soni & Janavi Popat

Authors
  1. Shubham Devang Soni
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  2. Janavi Popat
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Corresponding author

Correspondence to Shubham Devang Soni .

Editor information

Editors and Affiliations

  1. Department of Electrical Engineering, Sardar Vallabhbhai National Institute of Technology, Surat, Gujarat, India

    Vasundhara Mahajan

  2. Department of Electrical Engineering, Sardar Vallabhbhai National Institute of Technology, Surat, Gujarat, India

    Anandita Chowdhury

  3. Department of Electrical and Electronics Engineering, Indian Institute of Information Technology and Management, Gwalior, Madhya Pradesh, India

    Sri Niwas Singh

  4. College of Engineering, Illinois Institute of Technology, Chicago, IL, USA

    Mohammad Shahidehpour

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© 2024 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Soni, S.D., Popat, J. (2024). An Efficient Micro-Bolometer Design for Temperature Measurement. In: Mahajan, V., Chowdhury, A., Singh, S.N., Shahidehpour, M. (eds) Emerging Technologies in Electrical Engineering for Reliable Green Intelligence. ICSTACE 2023. Lecture Notes in Electrical Engineering, vol 1117. Springer, Singapore. https://doi.org/10.1007/978-981-99-9235-5_33

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