Skip to main content

Implementation of Virtual Sensor for Semiconductor Process Verification Using Machine Learning

  • Conference paper
  • First Online:
Advances in Computer Science and Ubiquitous Computing (CUTECSA 2022)

Abstract

The facility that performs the exposure process during semiconductor process verification includes more than 2500 sensors, and if an abnormal value is detected in any of these sensors, the wafer is treated as an exception. Wafers treated as exceptions undergo and additional process of determining wherein it is determined through physical measurement whether they are normal or abnormal. In this study, to reduce the time and cost of physical measurement, machine learning is used to learn sensor values to predict measurement results and to implement virtual sensors based on predicted values. The method for determining whether an exposure process is normal or abnormal is suggested using the implemented virtual sensor. The virtual sensor implements a single virtual sensor and multiple virtual sensors, and the algorithms used are extreme gradient boosting (XGBoost) and multi-output classifier. As a result of the experiment, the single virtual sensor detected an average of 93% of defects, furthermore, when measuring the detected defective wafers, an average of 99% of the actual defects were detected. Multiple virtual sensors also exhibited an average performance of 93%. Based on the findings of this study, 2500 real sensors were implemented as 250 virtual sensors, enabling the reduction of the time required to verify semiconductor exposure process results.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 219.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 279.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 279.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Ding D, Wu X, Ghosh J, Pan D-Z (2009) Machine learning based lithographic hotspot detection with critical-feature extraction and classification. In: 2009 IEEE international conference on IC design and technology, pp 219–222

    Google Scholar 

  2. Jang S, Jo M, Cho S, Moon B (2018) Defect prediction using machine learning algorithm in semiconductor test process. J Korean Inst Electr Electron Mater Eng 31(7):450–454

    Google Scholar 

  3. Kim HG, Han YS, Lee J-H (2015) Package yield enhancement using machine learning in semiconductor manufacturing. In: 2015 IEEE advanced information technology, electronic and automation control conference (IAEAC). IEEE

    Google Scholar 

  4. Moyne J, Iskandar J (2017) Big data analytics for smart manufacturing: case studies in semiconductor manufacturing. Processes 5(3):39

    Article  Google Scholar 

  5. Mathirajan M, Sivakumar AI (2006) A literature review, classification and simple meta-analysis on scheduling of batch processors in semiconductor. Int J Adv Manuf Technol 29(9):990–1001

    Article  Google Scholar 

  6. Chen T, Guestrin C (2016) XGBoost: a scalable tree boosting system. In: Proceedings of the 22nd ACM SIGKDD international conference on knowledge discovery and data mining (KDD’16). Association for Computing Machinery, pp 785–794

    Google Scholar 

  7. Rokach L (2010) Ensemble-based classifiers. Artif Intell Rev 33(1):1–39

    Article  MathSciNet  Google Scholar 

  8. Abd Elrahman SM, Abraham A (2013) A review of class imbalance problem. J Netw Innov Comput 1(2013):332–340

    Google Scholar 

  9. Chawla NV, Bowyer KW, Hall LO, Kegelmeyer WP (2002) SMOTE: synthetic minority over-sampling technique. J Artif Intell Res 16:321–357

    Article  MATH  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Jin Gon Shon .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2023 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Shin, J.I., Park, J.S., Shon, J.G. (2023). Implementation of Virtual Sensor for Semiconductor Process Verification Using Machine Learning. In: Park, J.S., Yang, L.T., Pan, Y., Park, J.H. (eds) Advances in Computer Science and Ubiquitous Computing. CUTECSA 2022. Lecture Notes in Electrical Engineering, vol 1028. Springer, Singapore. https://doi.org/10.1007/978-981-99-1252-0_15

Download citation

  • DOI: https://doi.org/10.1007/978-981-99-1252-0_15

  • Published:

  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-99-1251-3

  • Online ISBN: 978-981-99-1252-0

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics