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An Insight into the Existing Reversible Arithmetic and Logic Unit Designs

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Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 748))

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Abstract

International Technology Roadmap for Semiconductors-ITRS2.0 predicts an end to traditional scaling and shrinking of chips by 2028. The future depends on the alternative technology to fill the gap and perform better than the existing technology. There are numerous technologies emerging, one among them being the reversible logic is fast gaining the importance due to the quantum technology for minimal dissipation of energy whose operation is reversible in nature. Arithmetic and logic operations are the core of any processing system and its importance is found in all the modern devices. Reversible logic assures to overcome the limitations of the current technologies and several designs have been proposed to build optimized, efficient reversible arithmetic and logic unit. This paper makes an effort to compare the existing ALU designs based on the different design approaches.

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Author information

Authors and Affiliations

  1. Department of ECE, Dr. Ambedkar Institute of Technology, Bengaluru, India

    S. Girija

  2. Department of ECE, RNSIT, Bengaluru, India

    B. G. Sangeetha

Authors
  1. S. Girija
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  2. B. G. Sangeetha
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Correspondence to S. Girija .

Editor information

Editors and Affiliations

  1. Department of Electronics and Communication Engineering, Birla Institute of Technology Mesra, Mesra, India

    Vijay Nath

  2. Department of Computer Science and Engineering, Kalyani University, Kolkata, India

    J. K. Mandal

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Girija, S., Sangeetha, B.G. (2021). An Insight into the Existing Reversible Arithmetic and Logic Unit Designs. In: Nath, V., Mandal, J.K. (eds) Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems. Lecture Notes in Electrical Engineering, vol 748. Springer, Singapore. https://doi.org/10.1007/978-981-16-0275-7_32

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  • DOI: https://doi.org/10.1007/978-981-16-0275-7_32

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-16-0274-0

  • Online ISBN: 978-981-16-0275-7

  • eBook Packages: EngineeringEngineering (R0)

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