Abstract
A CFD analysis is performed using nanofluids flow on a microchannels rectangular heat sink under uniform heat flux condition for forced convection cooling of electronic devices. In the present investigation, eight varying concentrations of Aluminum Oxide, Titanium Dioxide, Copper Oxide, Silicon Dioxide and Zinc Oxide nanoparticles, and EG20 (mixture of ethylene glycol 20% wt. and water), water as base fluids are considered. By considering the single-phase model, numerical computation is performed using ANSYS Fluent software. To examine the validity, results are compared with previous experimental and numerical research data. Further, different heat transfer parameters are presented and analyzed. From this analysis, it was noted that with the addition of nanoparticles there are sharp decrements in local thermal resistance and increment in local heat transfer coefficient compared to base fluid. There is a large improvement in heat transfer parameters is noticed in the case of CuO nanoparticles having a concentration of 1 and 4% in water base fluid.
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Acknowledgements
This research was supported by the mechanical engineering department at Maulana Azad National Institute of Technology, Bhopal.
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Bhuvad, S.S., Patel, A.K., Rajput, S.P.S. (2021). CFD Analysis for Heat Transfer Enhancement of Microchannels Heat Sink Using Nanofluid Flow in Case of Electronics Device. In: Kalamkar, V., Monkova, K. (eds) Advances in Mechanical Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-3639-7_13
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DOI: https://doi.org/10.1007/978-981-15-3639-7_13
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