Abstract
In this work, a microchannel heat sink (MCHS) of dimension 40 mm × 40 mm × 14 mm with a circular copper tube (ID 0.8 mm) is designed, mimicking microelectronic component. The MCHS is subjected to a constant temperature condition which is mitigated via convective flow of single-phase fluid and different nanofluids. The investigation focused upon the heat transfer characteristics of all the coolants and to elucidate the effect of non-spherical nanoparticles in nanofluid. Here, the fluid flow and heat transfer parameters of the MCHS are focused experimentally at a constant Reynolds number of 1170 (velocity 1.19 m/s). Four coolants were used to study the heat transfer characteristics of the MCHS which was subjected to constant surface temperature of 125 °C, namely de-ionized (DI) water (hereafter abbreviated as water), Water + 0.0005% (v/v) CuO, Water + 0.0005% (v/v) multi-wall carbon nanotube (MWCNT) and DI water + 0.0005% (v/v) wax-intercalated MWCNT (WICNT). The wax is the phase change material (PCM) in this context which was encapsulated within MWCNT via self-sustained diffusion. Carbon nanotubes had an aspect ratio of 200. During the experiment, the temperature of particular depth within the MCHS from the surface was monitored. The maximum allowable limit of that particular point, aka the part of the integrated circuit (IC), was fixed between 70 and 50 °C, while the lower one is considered safe, whereas the upper one is critical for IC. It was seen that over a long period of unsteady-state investigation, the effect of WICNT was more pronounced in reducing the time required to lower the temperature to the safe operating limit. The cooling time of MCHS is reduced by 11.54% and 20.77% using Water + 0.0005% (v/v) multi-wall carbon nanotube and wax-intercalated MWCNT, respectively, over water which explains that WICNT enhances the heat transfer which is beneficial to increase the total operation time or computation time at the same memory usage rate.
Manoj Kumar, Vikram Bisht and Sheshang Singh Chandel—Contribution equally.
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References
Y. Shabany, Heat Transfer: Thermal Management of Electronics (CRC press, 2009)
D.B. Tuckerman, R.F.W. Pease, High-performance heat sinking for VLSI. IEEE Electron. Device Lett. 2(5), 126–129 (1981)
M. Groll, M. Schneider, V. Sartre, M.C. Zaghdoudi, M. Lallemand, Thermal control of electronic equipment by heat pipes.Revue générale de thermique 37(5): 323–352 (1998)
C.B. Sobhan, R.L. Rag, G.P. Peterson, A review and comparative study of the investigations on micro heat pipes. Int. J. Energy Res. 31(6–7), 664–688 (2007)
S.U.S. Choi, A.E. Jeffrey, Enhancing Thermal Conductivity of Fluids with Nanoparticles. No. ANL/MSD/CP-84938; CONF-951135-29. Argonne National Lab., IL (United States), 1995.
X. Wang, X. Xu, S.U.S. Choi, Thermal conductivity of nanoparticle-fluid mixture. J. Thermophys. Heat Transfer 13(4), 474–480 (1999)
S. Lee, S.S. Choi, S.A. Li, J.A. Eastman, Measuring thermal conductivity of fluids containing oxide nanoparticles. J. Heat Transfer 121(2), 280–289 (1999)
S.P. Jang, S.U.S. Choi, Cooling performance of a microchannel heat sink with nanofluids. Appl. Therm. Eng. 26(17–18), 2457–2463 (2006)
R. Chein, J. Chuang, Experimental microchannel heat sink performance studies using nanofluids. Int. J. Therm. Sci. 46(1), 57–66 (2007)
J.-Y. Jung, H.-S. Oh, H.-Y. Kwak, Forced convective heat transfer of nanofluids in microchannels. Int. J. Heat Mass Transf. 52(1–2), 466–472 (2009)
T.C. Hung, W.M. Yan, X.D. Wang, C.Y. Chang, Heat transfer enhancement in microchannel heat sinks using nanofluids. Int. J. Heat Mass Transf. 55(9–10), 2559–2570 (2012)
https://www.uk-cpi.com/case-studies/cooling-of-nanoquenching-fluids-for-the-aerospace-industry
P.K. Singh, P.V. Harikrishna, T. Sundararajan, S.K. Das, Experimental and numerical investigation into the hydrodynamics of nanofluids in microchannels. Exp. Thermal Fluid Sci. 42, 174–186 (2012)
S. Sinha-Ray, S. Sinha-Ray, H. Sriram, A.L. Yarin, Flow of suspensions of carbon nanotubes carrying phase change materials through microchannels and heat transfer enhancement. Lab Chip 14(3), 494–508 (2014)
P.K. Schelling, S. Li, E.G. Kenneth, Managing heat for electronics. Mater. Today 8(6), 30–35 (2005)
Jaconelli, L. and Anton, P. “Numerical Verification of Mobile Thermal Energy Storage Performance.” (2017).
F.L. Tan, C.P. Tso, Cooling of mobile electronic devices using phase change materials. Appl. Therm. Eng. 24(2–3), 159–169 (2004)
R. Srikanth, P. Nemani, C. Balaji, Multi-objective geometric optimization of a PCM based matrix type composite heat sink. Appl. Energy 156, 703–714 (2015)
Y. Cui, C. Liu, S. Hu, X. Yu, The experimental exploration of carbon nanofiber and carbon nanotube additives on thermal behavior of phase change materials. Sol. Energy Mater. Sol. Cells 95(4), 1208–1212 (2011)
S. Motahar, N. Nikkam, A.A. Alemrajabi, R. Khodabandeh, M.S. Toprak, M. Muhammed, Experimental investigation on thermal and rheological properties of n-octadecane with dispersed TiO2 nanoparticles. Int. Commun. Heat Mass Transfer 59, 68–74 (2014)
X. Jiang, R. Luo, F. Peng, Y. Fang, T. Akiyama, S. Wang, Synthesis, characterization and thermal properties of paraffin microcapsules modified with nano-Al2O3. Appl. Energy 137, 731–737 (2015)
S. Sinha-Ray, R.P. Sahu, A.L. Yarin, Nano-encapsulated smart tunable phase change materials. Soft Matter 7(19), 8823–8827 (2011)
R.L. Hamilton, O.K. Crosser, Thermal conductivity of heterogeneous two-component systems. Ind. Eng. Chem. Fundam. 1(3), 187–191 (1962)
T.Y. Choi, D. Poulikakos, J. Tharian, U. Sennhauser, Measurement of the thermal conductivity of individual carbon nanotubes by the four-point three-ω method. Nano Lett. 6(8), 1589–1593 (2006)
E. George, R. Shah, D. Forester, Fuels and Lubricants Handbook: Technology, Properties, Performance, and Testing (ASTM International, USA, 2003), p. 224
Contribution of Authors
M.K. and S.S.C. performed the heat transfer experiments and analyzed data. V.B. conducted the experiments with CNTs. P.K. and S.S-R. conceived the idea. M.K., V.B. and S.S.C. equally contributed in writing the manuscript.
Acknowledgements
M.K. and V.B. acknowledge the scholarship from Ministry of Human Resource and Development, Govt. of India and S.S.C. acknowledges the funding support from DST-SERB (IITM/SERB/SSR/215).
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Authors declare no conflict of interest.
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Kumar, M., Bisht, V., Chandel, S.S., Sinha-Ray, S., Kumar, P. (2021). Convective Flow of Nanofluid and Nanoencapsulated Phase Change Material Through Microchannel Heat Sink for Passive Cooling of Microelectronics. In: Pandey, K., Misra, R., Patowari, P., Dixit, U. (eds) Recent Advances in Mechanical Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-7711-6_6
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