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Overview of Heterogeneous Integrations

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Heterogeneous Integrations

Abstract

Multichip module (MCM), system-in-package (SiP), and heterogeneous integration use packaging technology to integrate dissimilar chips, optical devices, and/or packaged chips with different materials and functions, from different fabless houses, foundries, wafer sizes, and feature sizes into a system or subsystem on different substrates or stand alone. What is the difference between MCM, SiP, and heterogeneous integration? The traditional MCM is mainly a 2D integration. The SiP can also be a 3D integration or called vertical-MCM or 3D-MCM. Heterogeneous integration is very similar to SiP, except heterogeneous integration is for finer pitches, more inputs/outputs (I/Os), higher density, and higher performance applications.

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Lau, J.H. (2019). Overview of Heterogeneous Integrations. In: Heterogeneous Integrations. Springer, Singapore. https://doi.org/10.1007/978-981-13-7224-7_1

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