Abstract
There are several ways to package and assemble integrated circuits (ICs) on printed wiring boards. Yet, in the case of hybrid circuits, IC chips have been used almost exclusively in packages supplied by the IC manufacturer. During the past several years, however, bare IC chips have come to be used, both singly and in multiples, on printed wiring boards in what is referred to as chip-on-board (COB) technology.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1985 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Ginsberg, G.L. (1985). Chip-and-Wire Technology. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_10
Download citation
DOI: https://doi.org/10.1007/978-3-662-13161-9_10
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive