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The Electronics Assembly Handbook

  • Frank Riley

Table of contents

  1. Front Matter
    Pages i-xix
  2. The Changing World of Electronics Assembly

    1. Front Matter
      Pages 1-2
    2. Charles-Henri Mangin
      Pages 6-9
  3. Circuit Boards

    1. Front Matter
      Pages 11-11
    2. W. Markstein
      Pages 13-15
    3. Howard W. Markstein
      Pages 15-20
    4. S. Leonard Spitz
      Pages 20-25
    5. S. Leonard Spitz
      Pages 25-32
    6. Mike Friedman, Walter Berry
      Pages 32-33
    7. Tom Dixon
      Pages 33-38
    8. Chip-on-Board

      1. Robert Keeler
        Pages 41-45
      2. Gerald L. Ginsberg
        Pages 45-51
      3. Gerald L. Ginsberg
        Pages 52-54
  4. Component Insertion

    1. Front Matter
      Pages 57-57
    2. Terence Thompson
      Pages 59-64
    3. Robert Keeler
      Pages 64-70
    4. Howard W. Markstein
      Pages 70-76
    5. Brian Corner
      Pages 76-79
    6. Nikita Andreiev
      Pages 79-81
    7. Robotic Assembly

      1. Charles-Henri Mangin
        Pages 85-86
      2. Frank Riley
        Pages 93-99
      3. Frank Riley
        Pages 99-103
      4. Frank Riley
        Pages 103-111
    8. Robotic Application

      1. Brian D. Hoffman, Steven H. Pollack, Barry Weissman
        Pages 115-119
  5. Surface-Mount Technology

    1. Front Matter
      Pages 121-121
    2. Don Brown, Contributing Editor, James Bracken, Anthony Manna, John Brasch, D. Brown
      Pages 123-129
    3. Torn Dixon
      Pages 129-137
    4. Frank Riley
      Pages 143-150
    5. Howard W. Markstein
      Pages 150-156
    6. Howard W. Markstein
      Pages 156-163
    7. Ronald Pound
      Pages 163-169
    8. S. Leonard Spitz
      Pages 169-175
    9. Jim Field, John Payne, Chris Cullen
      Pages 175-179
    10. The Demands of SMT

      1. Donald A. Elliot
        Pages 183-190
      2. Ronald Pound
        Pages 195-201
      3. Linus Wallgren
        Pages 201-204
  6. Hybrid Circuits

    1. Front Matter
      Pages 205-205
    2. Don Brown, Martin Freedman
      Pages 207-211
    3. Jerry E. Sergent
      Pages 211-216
    4. A. W. Koszykowski
      Pages 216-217
  7. Soldering and Cleaning

    1. Front Matter
      Pages 219-219
    2. Frank Riley
      Pages 221-224
    3. Solder Quality Definition

      1. Joe Keller
        Pages 227-230
      2. J. Gordon Davy
        Pages 230-236
    4. Wave Soldering

      1. Ranold Pound
        Pages 239-245
      2. Lawrence Cox
        Pages 245-251

About this book

Introduction

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Keywords

Local Area Network Standard coating computer design development electronics manufacturing production reliability robotics simulation structured design testing

Editors and affiliations

  • Frank Riley
    • 1
  1. 1.The Bodine CorporationBridgeportUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-13161-9
  • Copyright Information Springer-Verlag Berlin Heidelberg 1988
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-662-13163-3
  • Online ISBN 978-3-662-13161-9
  • Buy this book on publisher's site