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The Electronics Assembly Handbook

  • Book
  • © 1988

Overview

Editors:
  1. Frank Riley

    1. The Bodine Corporation, Bridgeport, USA

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Table of contents (94 chapters)

  1. Front Matter

    Pages i-xix
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  2. The Changing World of Electronics Assembly

    1. Front Matter

      Pages 1-2
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    2. Systems, Vision and Components in Electronics Assembly

      • Frank Riley
      Pages 3-6

    3. Managing Automated Electronics Assembly

      • Charles-Henri Mangin
      Pages 6-9

  3. Circuit Boards

    1. Front Matter

      Pages 11-11
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    2. PCB Production Equipment

      • W. Markstein
      Pages 13-15

    3. Modern Platers and Etchers

      • Howard W. Markstein
      Pages 15-20

    4. Chemicals in PCB Manufacturing

      • S. Leonard Spitz
      Pages 20-25

    5. Cleaning PCBs for Higher Quality

      • S. Leonard Spitz
      Pages 25-32

    6. Producing Quality Multilayer PCBs

      • Mike Friedman, Walter Berry
      Pages 32-33

    7. Plasma Desmearing

      • Tom Dixon
      Pages 33-38

    8. Chip-on-Board

      1. Chip-on-board Technology
        • Robert Keeler
        Pages 41-45
      2. Chip-and-Wire Technology
        • Gerald L. Ginsberg
        Pages 45-51
      3. Tab and Flip-Chip Technology
        • Gerald L. Ginsberg
        Pages 52-54

  4. Component Insertion

    1. Front Matter

      Pages 57-57
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    2. Component Insertion Equipment

      • Terence Thompson
      Pages 59-64

    3. Workstations

      • Robert Keeler
      Pages 64-70

    4. Automatic Component Insertion/Placement Systems

      • Howard W. Markstein
      Pages 70-76

    5. Automated Pin Insertion

      • Brian Corner
      Pages 76-79

    6. Automated Placement Techniques

      • Nikita Andreiev
      Pages 79-81
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Keywords

About this book

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Editors and Affiliations

  • The Bodine Corporation, Bridgeport, USA

    Frank Riley

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