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CMP Polishing Pads

  • Chapter
Chemical-Mechanical Planarization of Semiconductor Materials

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 69))

Abstract

Although polishing is an old technology [1, 2, 3], it has become an enabling process for the manufacture of leading-edge semiconductor devices. In the manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal layers. Also as noted in the first chapter, CMP is now also employed to remove a bulk film and then stop, as in damascene copper and tungsten polishing. As semiconductor devices become increasingly complex, requiring finer feature geometries and more metallization layers, greater demands are placed on the polishing consumables used in the CMP process to manufacture such devices [4, 5, 6].

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Authors
  1. David B. James
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Editors and Affiliations

  1. Rodel Inc., 14625 NW Skyline Boulevard, 97231, Portland, OR, USA

    Michael R. Oliver (Rodel Fellow) (Rodel Fellow)

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© 2004 Springer-Verlag Berlin Heidelberg

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James, D.B. (2004). CMP Polishing Pads. In: Oliver, M.R. (eds) Chemical-Mechanical Planarization of Semiconductor Materials. Springer Series in Materials Science, vol 69. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-06234-0_6

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  • DOI: https://doi.org/10.1007/978-3-662-06234-0_6

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-07738-8

  • Online ISBN: 978-3-662-06234-0

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