Chemical-Mechanical Planarization of Semiconductor Materials

  • Michael R. Oliver

Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 69)

Table of contents

  1. Front Matter
    Pages I-XI
  2. Michael R. Oliver
    Pages 1-6
  3. Michael R. Oliver
    Pages 7-40
  4. D. R. Evans
    Pages 41-83
  5. David Stein
    Pages 85-132
  6. Thomas Tucker
    Pages 133-165
  7. David B. James
    Pages 167-213
  8. Karl Robinson
    Pages 215-249
  9. John de Larios
    Pages 251-281
  10. D. Boning, D. Hetherington
    Pages 283-349
  11. K. M. Robinson, K. DeVriendt, D. R. Evans
    Pages 351-417
  12. Back Matter
    Pages 419-428

About this book

Introduction

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Keywords

dielectrics material metals reactions semiconductor semiconductor technology

Editors and affiliations

  • Michael R. Oliver
    • 1
  1. 1.Rodel Inc.PortlandUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-06234-0
  • Copyright Information Springer-Verlag Berlin Heidelberg 2004
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-07738-8
  • Online ISBN 978-3-662-06234-0
  • Series Print ISSN 0933-033X
  • Series Online ISSN 2196-2812
  • About this book