Abstract
Recent progress in experimentally and theoretically understanding interfaces at the atomic level suggest that ultimate electronic systems may one day be fabricated on a single integrated chip. If such elements as Si VLSI processors, GaAs/AIAs integrated optoelectronic 10 devices, II-VI superlattice visible displays and high speed III-V processors are to be integrated, interface formation and in situ processing will be required at a level of sophistication well beyond what is available today. In this paper, we review recent developments in interface formation by both MOCVD and MBE. To illustrate the power of our diagnostic methods, the details of epitaxial interface formation on an atomic scale are reviewed for lattice matched systems (Ge/GaAs/AIAs) and epitaxial silicides (Ni/Si2/Si) as well as oxidation of silicon to form Si/SiO2 interfaces. New developments in using lattice mismatched superlattices with strained layers are discussed for CdTe/ZnTe. Additional complications of growing compound semiconductors on elemental substrates (e.g., anti-phase domains) are discussed for GaAs growth on Si(l00).
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Bauer, R.S., Miles, R.H., McGill, T.C. (1987). Perspectives on Formation and Properties of Semiconductor Interfaces. In: Le Lay, G., Derrien, J., Boccara, N. (eds) Semiconductor Interfaces. Springer Proceedings in Physics, vol 22. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-72967-6_28
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DOI: https://doi.org/10.1007/978-3-642-72967-6_28
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