Abstract
Mg-implanted layers (5 x 1014 to 5 x 1015 cm-2) which are annealed at low temperatures (500°C to 600°C) show high n-type conductivity. Contrary to the usual doping elements in silicon, the sheet carrier concentration shows a sharp decrease with increasing annealing temperatures; minimum sheet resistivities of 800 Q/a were obtained after a “thermal” annealing step at 550°C for 30 min. From profile measurements (Hall effect and SIMS), it is concluded that the interstitial solubility for Mg at 500°C in these samples is as high as 1 x 1018 cm-3. At temperatures above 700°C the electrically active Mg concentration is rapidly gettered by the damage layer and Mg precipitates., and becomes electrically inactive. A model for the segregation behavior of Mg in silicon is discussed briefly.
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© 1983 Springer-Verlag Berlin Heidelberg
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Sigmund, H., Weiß, D. (1983). Doping Behavior of Implanted Magnesium in Silicon. In: Ryssel, H., Glawischnig, H. (eds) Ion Implantation: Equipment and Techniques. Springer Series in Electrophysics, vol 11. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-69156-0_54
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DOI: https://doi.org/10.1007/978-3-642-69156-0_54
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