Abstract
The goal of non-electrical measurements in the field of ion implantation is to determine quantitative depth profiles of the total concentration of the implanted species, generally together with an evaluation of the damage produced by the ion bombardment. Thermal or beam annealing of implanted samples.results in a rearrangement of the impurity and host-material configuration via diffusion and lattice reconstruction. Following a short review of the analytical problems encountered in implantation work and the various measuring techniques, it is shown that secondary ion mass spectroscopy (SIMS) offers the most favorable solution for implantation-related studies if combined with complementary nuclear measurement techniques, especially neutron and high-energy ion beam analysis, which are of particular usefulness in the high-concentration range and in cases where interfaces are to be included in the analysis. Making use of the channeling effect, high-energy ions can also provide valuable information about lattice damage and incorporation of impurities on lattice sites, while for the classification of extended defects, X-ray topography and transmission electron microscopy (TEM) are indispensable tools.
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References
Ion Beam Modification of Materials, R.E. Benneson, E.N. Kaufmann, G.L. Miller, and W.W. Scholz eds., North Holland Pub!. Co., Amsterdam 1981.
K. Wittmaack and J.B. Clegg, Appl.Phys. Lett. 37, 286 (1980).
P. Williams and C.A. Evans, Jr., Appl.Phys. Lett. 30, 560 (1977).
J.B. Clegg, Surface and Interface Analysis, Vol. 2, No. 3, Heyden and Sons Ltd., 1980.
W.K. Stuckey in Systematic Materials Analysis IV, J.H. Richardson and R.V. Peterson eds., Academic Press, New York 1976.
J.W. Col burn, E. Taglauer, and E. Kay, J. Appl.Phys. 45, 1779 (1974).
V.6. Isotopes Ltd, Publ. 02. 484 (1982).
M. Maier, D. Bimberg, H. Baumgart, and F. Phillip in Secondary Mass Spectroscopy SIMS III, A. Benninghoven, J. Giber, J. Läszlö, M. Riedel, and H.W. Werner eds., Springer-Verlag, Berlin 1982.
H. Oechsner and E. Stumpe, Appl.Phys. 14, 43 (1977).
G. Blaise, Surf. Sei. 60, 65 (1976).
K.R. Williamson, W.M. Theis, S.S. Yun, and Y.S. Park, J. Appl.Phys. 50, 8019 (1979).
H. Ryssel et al., to be published.
T. Bereznai, F. DeCorte, and J. Hosk, Radiochem. and Radioanal. Lett. 17, 279 (1974).
A.P. Janssen and J.A. Venables, Ninth Int. Congr. on Electr. Microscopy, Toronto 1978, Vol. I, p. 520
J. A Borders in Site Characterization and Aggregation of Implanted Materials, A. Perez and R. Coussement eds., Plenum Publ. Co., New York 1980.
M.T. Thomas, D.R. Baer, Technol. 17, 25 (1980).
M. Baron, A.L. Chang, J. Meth. 182/183, 531 (1980).
Ion Beam Handbook for Material Academic Press, New York 1977. 19. The Stopping and Ranges of Ions in Matter, Vol. 3 and 4, H.H Anderson, J.F. Ziegler eds. Pergamon Press, New York 1977.
D.M. Scott and M.-A. Nicolet, Nucl. Instr. & Meth. 182/183, 665 (1981).
H. Ryssel, F. Iberl, M. Bleier, G. Prinke, K. Appl.Phys. 24, 197 (1981)
T. Chiu, H. Bernt, and I. Rüge, J. Electrochem.Soc. 129, 408 (1982).
R. Hezel and N. Lieske, J. Electrochem. Soc. 129, 379 (l982). 24. J.F. Ziegler, G. W. Cole, and J.E.E. Baglin, J. Appl.Phys. 43, 3809 (1972).
H. Ryssel, K. Müller, K. Haberger, R. Henkelmann, and F. Jahnel, Appl.Phys. 22, 35 (1980).
L.J. Pilione and B.S. Carpenter, Nucl. Instr.. & Meth., 188, 639 (1981).
J. Hirvonen, Appi. Phys. 23, 349 (1980)
G. Amsel and D. Samuel, J.Phys. Chem. Solids 23, 1707 (1962). 29. C.W. Magee, R.E. Honig, and C.A. Avans, Jr., in 8, p. 172.
H. E. Rosendaal in Sputtering by Particle Bombardment I, R. Betrisch ed., Springer-Verlag, Berlin 1981.
J. Maul and K. Wittmaak, Surf. Sci. 47, 358 (1975).
K. Wittmaack, Appl.Phys. Lett. 29, 552 (1976).
K. Wittmaack, Proc. 7th Intern. Vac.Congr. and 3rd Conf. Solid Surf., R. Dobrozemsky et al., eds. Vienna 1977, p. 2573.
B.L. Bentz and H. Liebl in L8J, p. 30.
J.M. Gourgout in 33, p. A-2755. 1980.
AT0MIKA Technische Physik GmbH, Ionprobe A-DIDA 3000, Technical brockure, Munich 1980.
CAMECA, Ion Microanalyzer ims 3f, technical brochure, Courbevoie 1980.
J.M. Gourgout, Chem. Phys. 9, 286 (1979).
W.-K. Chu, J.W. Mayer, and M.-A. Academic Press, New York 1978.
M. Takai, P.H. Tsien, S.C. Tsou, D. Röschenthaler, M. Ramin, H. Ryssel, and I. Rüge, Appl.Phys. 22, 129 (1980).
J. Hory and Y. Quere, Rad. Effects 13, 57 (1972).
L. Csepregi, E.F. Kennedy, S.S. Lau, and J.W. Mayer, Appl.Phys. Lett. 29, 645 (1976)
B. Gruska and G. Götz, Phys.Stat.Sol.(a) 67, 129 (1981).
S. Namba and K. Masuda, Advances in Electronics and Electron Physics 37, 263 (1975).
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Eichinger, P., Ryssel, H. (1982). Non-Electrical Measuring Techniques. In: Ryssel, H., Glawischnig, H. (eds) Ion Implantation Techniques. Springer Series in Electrophysics, vol 10. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-68779-2_10
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DOI: https://doi.org/10.1007/978-3-642-68779-2_10
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