Abstract
The unifying feature of this chapter is that a thin solid film of polymer is formed by polymerization of a reactive gaseous species, which has been generated in the gas phase by thermal activation of the precursor. This process is an important alternative to the deposition of spin-on polymer dielectric thin films, because it includes a range of advantageous features. Some of these are excellent conformality over complex topography, the possibility of good film uniformity on large-diameter wafers, and environmentally safe processing due to the absence of solvents. The most important low-k polymers synthesized by this process are Parylene-N, Parylene-F, polynaphthalene, fluorinated polynaphthalene, Teflon, Teflon AF®and polyimides. The synthesis of these materials and their properties are discussed in this chapter, along with the prospects of their integration in devices of the near future.
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Gill, W.N., Rogojevic, S., Lu, T. (2003). Vapor Deposition of Low-k Polymeric Dielectrics. In: Ho, P.S., Leu, J.J., Lee, W.W. (eds) Low Dielectric Constant Materials for IC Applications. Springer Series in Advanced Microelectronics, vol 9. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-55908-2_4
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DOI: https://doi.org/10.1007/978-3-642-55908-2_4
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