Low Dielectric Constant Materials for IC Applications

  • Paul S. Ho
  • Jihperng Jim Leu
  • Wei William Lee

Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 9)

Table of contents

  1. Front Matter
    Pages I-XIX
  2. E. T. Ryan, A. J. McKerrow, J. Leu, P. S. Ho
    Pages 23-74
  3. W. N. Gill, S. Rogojevic, T. Lu
    Pages 95-119
  4. K. Endo, K. Kishimoto, Y. Matsubara, K. Koyanagi
    Pages 121-166
  5. W. Volksen, C. J. Hawker, J. L. Hedrick, V. Lee, T. Magbitang, M. Toney et al.
    Pages 167-202
  6. D. M. Martini, J. A. Kelber
    Pages 203-220
  7. F. Faupel, A. Thran, M. Kiene, T. Strunskus, V. Zaporojtchenko, K. Behnke
    Pages 221-251
  8. G. S. Oehrlein, T. E. F. M. Standaert, P. J. Matsuo
    Pages 253-276
  9. Joost J. Waeterloos
    Pages 277-304
  10. Back Matter
    Pages 305-309

About this book

Introduction

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Keywords

Dielectric Materials Integrated circuit manufacture Interconnects Low dielectric constant Permittivity Semiconductor integrated circuit packaging plasma etching thin film

Editors and affiliations

  • Paul S. Ho
    • 1
  • Jihperng Jim Leu
    • 2
  • Wei William Lee
    • 3
  1. 1.Texas Materials InstituteThe University of Texas at AustinAustinUSA
  2. 2.Intel Corp., MS: RA1-204HillsboroUSA
  3. 3.Taiwan Semiconductor Manufacturing Co. (TSMC)Hsin-chuTaiwan

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-642-55908-2
  • Copyright Information Springer-Verlag Berlin Heidelberg 2003
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-63221-1
  • Online ISBN 978-3-642-55908-2
  • Series Print ISSN 1437-0387
  • About this book