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Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities

  • Jacob W. Chesna
  • Stuart T. Smith
  • D. J. Hastings
  • Borja de la Maza
  • Bartoz K. Nowakowski
  • Feilong Lin
Part of the IFIP Advances in Information and Communication Technology book series (IFIPAICT, volume 371)

Abstract

This abstract outlines current developments of a micro-assembly facility focusing on studies using a three fingered gripper. Individual fingers of the gripper comprise thin fibers ranging in diameter from 7 to 80 μm that are attached to quartz based oscillators and are capable of sensing proximity, contact, and controlling adhesion forces. To optimize gripper finger performance, an electrolytic etching facility has been used to selectively modify oscillator performance and this system is currently being developed for automated processing. To demonstrate current performance of the gripper system, a micro-CMM contact sensing probe has been assembled and a preliminary performance evaluation is presented.

Keywords

Micro-robotics 3D surface profilometry micro-scale high aspect ratio standing wave probes micro-CMM 

References

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Copyright information

© IFIP International Federation for Information Processing 2012

Authors and Affiliations

  • Jacob W. Chesna
    • 1
  • Stuart T. Smith
    • 1
  • D. J. Hastings
    • 1
  • Borja de la Maza
    • 2
  • Bartoz K. Nowakowski
    • 1
  • Feilong Lin
    • 1
  1. 1.Center for Precision MetrologyUniversity of North Carolina at CharlotteUSA
  2. 2.Innovalia MetrologyBilbao-VizcayaSpain

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