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Introduction to Micro/Nanofabrication

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Springer Handbook of Nanotechnology

Part of the book series: Springer Handbooks ((SHB))

Abstract

This chapter outlines and discusses important micro- and nanofabrication techniques. We start with the most basic methods borrowed from the integrated circuit (IC) industry, such as thin film deposition, lithography and etching, and then move on to look at MEMS and nanofabrication technologies. We cover a broad range of dimensions, from the micron to the nanometer scale. Although most of the current research is geared towards the nanodomain, a good understanding of top-down methods for fabricating micron-sized objects can aid our understanding of this research. Due to space constraints, we have focused here on the most important technologies; in the microdomain these include surface, bulk and high aspect ratio micromachining; in the nanodomain we concentrate on e-beam lithography, epitaxial growth, template manufacturing and self-assembly. MEMS technology is maturing rapidly, with some new technologies displacing older ones that have proven to be unsuited to manufacture on a commercial scale. However, the jury is still out on methods used in the nanodomain, although it appears that bottom-up methods are the most feasible, and these will have a major impact in a variety of application areas such as biology, medicine, environmental monitoring and nanoelectronics.

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Abbreviations

AFM:

atomic force microscopy

CMOS:

complementary metal oxide semiconductor

CVD:

chemical vapor deposition

DC:

direct current

DMD:

digital micromirror device

DNA:

deoxyribonucleic acid

DPN:

dip-pen nanolithography

DRIE:

deep reactive ion etching

EDP:

ethylene diamine pyrocatechol

FE:

finite element

HF:

hydrofluoric acid

IC:

integrated circuit

LPCVD:

low-pressure chemical vapor deposition

MEMS:

microelectromechanical system

OTS:

octadecyltrichlorosilane

PDMS:

polydimethylsiloxane

PE:

polyethylene

PECVD:

plasma enhanced chemical vapor deposition

PMMA:

polymethylmethacrylate

PZT:

lead zirconium titanate

RF:

radio-frequency

RIE:

reactive ion etching

SAM:

scanning acoustic microscopy

SAM:

self-assembled monolayer

SEM:

scanning electron microscopy

SOI:

silicon-on-insulator

SPM:

scanning probe microscopy

STM:

scanning tunneling microscopy

TEM:

transmission electron microscopy

UHV:

ultrahigh vacuum

VLSI:

very large-scale integration

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Authors and Affiliations

  1. Department of Electrical and Computer Engineering, Purdue University, 465 Northwestern Avenue, 47907-2035, West Lafayette, IN, USA

    Babak Ziaie Prof.

  2. Institut de Microelectronica de Barcelona (IMB) (CNM-CSIC), Centro National Microelectrónica, Barcelona, Spain

    Antonio Baldi Prof.

  3. Department of Electrical and Computer Engineering, Western Michigan University, 49008, Kalamazoo, MI, USA

    Massood Atashbar Prof.

Authors
  1. Babak Ziaie Prof.
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  2. Antonio Baldi Prof.
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  3. Massood Atashbar Prof.
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Correspondence to Babak Ziaie Prof. , Antonio Baldi Prof. or Massood Atashbar Prof. .

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Editors and Affiliations

  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM), Ohio State University, 201 W. 19th Avenue, W 390 Scott Laboratory, Ohio 43210-1142, Columbus, OH, USA

    Bharat Bhushan Prof.

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Ziaie, B., Baldi, A., Atashbar, M. (2007). Introduction to Micro/Nanofabrication. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-29857-1_7

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