Abstract
Line-end cut process is used to create very fine metal wires in sub-14 nm technology. Cut patterns split regularly spaced line patterns into a number of wire segments, some of which become actual routing wires while the remainders are regarded as dummy . In sub-10 nm technology, cuts are smaller than optical resolution limit and a directed self-assembly lithography with multiple patterning (MP-DSAL) is a good candidate for their patterning. Cut optimization for MP-DSAL is addressed in this chapter. The optimization goal is to determine cut locations in such a way that cuts are grouped into manufacturable GPs, which are then assigned to one of the masks without MP coloring conflicts; minimizing wire extensions is also pursued in the process. The optimization problem is formulated as ILP and a fast heuristic algorithm is also presented.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Y. Badr, A. Torres, P. Gupta, Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias, in Proceedings of the Design Automation Conference (2015), pp. 70:1–70:6
J. Ou, B. Yu, D. Pan, Concurrent guiding template assignment and redundant via insertion for DSA-MP hybrid lithography, in Proceedings of the International Symposium on Physical Design (2016), pp. 39–46
S. Shim, W. Chung, Y. Shin, Redundant via insertion for multiple-patterning directed-self-assembly lithography, in Proceedings of the Design Automation Conference (2016), pp. 41:1–41:6
Z.W. Lin, Y.W. Chang, Double-patterning aware DSA template guided cut redistribution for advanced 1-D gridded designs, in Proceedings of the International Symposium on Physical Design (2016), pp. 47–54
W. Ponghiran, S. Shim, Y. Shin, Cut mask optimization for multi-patterning directed self-assembly lithography, in Proceedings of the Design, Automation and Test in Europe (DATE) (2017), pp. 1498–1503
M. Muramatsu, M. Iwashita, T. Kitano, T. Toshima, M. Somervell, Y. Seino, D. Kawamura, M. Kanno, K. Kobayashi, T. Azuma, Nanopatterning of diblock copolymer directed self-assembly lithography with wet development. J. Micro/Nanolithography, MEMS, MOEMS 11(3), 1–6 (2012)
Y. Seino, H. Yonemitsu, H. Sato, M. Kanno, H. Kato, K. Kobayashi, A. Kawanishi, T. Azuma, M. Muramatsu, S. Nagahara, T. Kitano, T. Toshima, Contact hole shrink process using graphoepitaxial directed self-assembly lithography. J. Micro/Nanolithography, MEMS, MOEMS 12(3), 1–6 (2013)
H. Yi, X. Bao, R. Tiberio, P. Wong, Design strategy of small topographical guiding templates for sub-15nm integrated circuits contact hole patterns using block copolymer directed self-assembly, in Proceedings of the SPIE Advanced Lithography (2013), pp. 1–9
S. Shim, S. Cai, J. Yang, S. Yang, B. Choi, Y. Shin, Verification of directed self-assembly (DSA) guide patterns through machine learning, in Proceedings of the SPIE Advanced Lithography (2015), pp. 1–8
H. Zhang, Y. Du, M.D.F. Wong, K.Y. Chao, Mask cost reduction with circuit performance consideration for self-aligned double patterning, in Proceedings of the Asia South Pacific Design Automation Conference (2011), pp. 787–792
S. Shim, W. Chung, Y. Shin, Defect probability of directed self-assembly lithography: fast identification and post-placement optimization, in Proceedings of the International Conference on Computer Aided Design (2015), pp. 404–409
Z. Xiao, C. Lin, M. Wong, Contact layer decomposition to enable DSA with multi-patterning technique for standard cell based layout, in Proceedings of the Asia South Pacific Design Automation Conference (2016), pp. 1–8
H. Yi, X. Bao, R. Tiberio, P. Wong, Design strategy of small topographical guiding templates for sub-15nm integrated circuits contact holepatterns using block copolymer directed self-assembly, in Proceedings of the SPIE Advanced Lithography (2013), pp. 1–9
Z. Xiao, Y. Du, H. Tian, M. Wong, H. Yi, H. Wong, H. Zhang, Directed self-assembly (DSA) template pattern verification, in Proceedings of the Design Automation Conference (2014), pp. 1–6
H. Yi, L. Azat, P. Wong, Computational simulation of block copolymer directed self-assembly in small topographical guiding templates, in Proceedings of the SPIE Advanced Lithography (2013), pp. 1–7
L. Azat, G. Grant, P. Moshe, S. Gerard, W. Wong, J. Xu, Y. Zou, Computational simulations and parametric studies for directed self-assembly process development and solution of the inverse directed self-assembly problem. Jpn. J. Appl. Phys. 53(6S), 1–8 (2014)
N. Laachi, K.T. Delaney, B. Kim, S. Hur, R. Bristol, D. Shykind, C.J. Weinheimer, G.H. Fredrickson, Self-consistent field theory investigation of directed self-assembly in cylindrical confinement. J. Polym. Sci. Part B, Polym. Phys. 53(2), 142–153 (2015)
M.C. Smayling, V. Axelrad, 32nm and below logic patterning using optimized illumination and double patterning, in Proceedings of the SPIE Advanced Lithography (2009), pp. 1–10
Z. Xiao, Y. Du, M. Wong, H. Zhang, DSA template mask determination and cut redistribution for advanced 1D gridded design, in Proceedings of the SPIE Advanced Lithography (2013), pp. 1–8
J. Ou, B. Yu, J.R. Gao, D. Pan, M. Preil, A. Latypov, Directed self-assembly based cut mask optimization for unidirectional design, in Proceedings of the Great Lakes Symposium on VLSI (2015), pp. 83–86
Z.W. Lin, Y.W. Chang, Cut redistribution with directed self-assembly templates for advanced 1-D gridded layouts, in Proceedings of the Asia South Pacific Design Automation Conference (2016), pp. 89–94
Gurobi Optimization, Inc., Gurobi optimizer reference manual, http://www.gurobi.com/
Opencores, http://www.opencores.org/
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2018 Springer International Publishing AG, part of Springer Nature
About this chapter
Cite this chapter
Shim, S., Shin, Y. (2018). Cut Optimization. In: Physical Design and Mask Synthesis for Directed Self-Assembly Lithography. NanoScience and Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-76294-4_9
Download citation
DOI: https://doi.org/10.1007/978-3-319-76294-4_9
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-76293-7
Online ISBN: 978-3-319-76294-4
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)