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Flip-Chip Die Attach Technology

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Area Array Interconnection Handbook

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Abstract

Wire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.

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Authors and Affiliations

  1. IBM Microelectronics Division, USA

    Peter J. Brofman, Kathleen A. Stalter & Charles Woychik

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  1. Peter J. Brofman
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  2. Karl J. Puttlitz
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  3. Kathleen A. Stalter
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  4. Charles Woychik
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Karl J. Puttlitz Paul A. Totta

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Brofman, P.J., Puttlitz, K.J., Stalter, K.A., Woychik, C. (2001). Flip-Chip Die Attach Technology. In: Puttlitz, K.J., Totta, P.A. (eds) Area Array Interconnection Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1389-6_8

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  • DOI: https://doi.org/10.1007/978-1-4615-1389-6_8

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  • Print ISBN: 978-1-4613-5529-8

  • Online ISBN: 978-1-4615-1389-6

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