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Product Connector Technology

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Area Array Interconnection Handbook

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Abstract

The use of product connectors has mainly involved high-end applications. Electronic modules normally represent a function, and one or more multichip modules typically are combined on a card or board. It is important that some or all the individual modules be easily separable to permit testing, diagnositcs and field repair, and that the separable connections not functionally degrade the electrical signals [1]. The intent is to preserve the value of a board and its attached components while having the capability to make repairs or upgrades through component exchanges throughout the lifetime of a part. Several early area-array “compression connection” concepts were reported in the mid 1980s/early 1990s that recognized that a disassembly design must also be capable of high I/O density to accommodate ever increasing I/O counts (i.e., extendible to decreasing pitches).

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Authors and Affiliations

  1. IBM Microelectronics, USA

    Lewis S. Goldmann

Authors
  1. Karl J. Puttlitz
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  2. Lewis S. Goldmann
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Editor information

Karl J. Puttlitz Paul A. Totta

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© 2001 Springer Science+Business Media New York

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Puttlitz, K.J., Goldmann, L.S. (2001). Product Connector Technology. In: Puttlitz, K.J., Totta, P.A. (eds) Area Array Interconnection Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1389-6_21

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  • DOI: https://doi.org/10.1007/978-1-4615-1389-6_21

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-5529-8

  • Online ISBN: 978-1-4615-1389-6

  • eBook Packages: Springer Book Archive

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