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Area Array Component Replacement Technology

  • Phil Isaacs
  • Karl J. Puttlitz

Abstract

As surface mount technology advanced from peripheral-leaded to area-array (AA) devices, assembly shops benefited from significant improvements in process yields and component reliability.

Keywords

Solder Joint Solder Ball Solder Bump Ball Grid Array Molten Solder 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2001

Authors and Affiliations

  • Phil Isaacs
    • 1
  • Karl J. Puttlitz
  1. 1.IBM (Server Group)USA

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