Abstract
Substrate influence is a common problem when using instrumented indentation (also known as nano-indentation) to evaluate the elastic modulus of thin films. Many have proposed models in order to be able to extract the film modulus (E f ) from the measured substrate-affected modulus, assuming that the film thickness (t) and substrate modulus (E s ) are known. Existing analytic models work well if the film is more compliant than the substrate. However, no analytic model accurately predicts response when the modulus of the film is more than double the modulus of the substrate. In this work, a new analytic model is reviewed. Using finite-element analysis, this new model is shown to be able to accurately determine film modulus (E f ) over the domain 0.1 < E f /E s < 10. Finally, the new model is employed to determine the Young’s modulus of low-k and silicon carbide films on silicon.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Hay, J.L. and Crawford, B., "Measuring Substrate-Independent Modulus of Thin Films," Journal of Materials Research, Accepted for publication in 2011.
Gao, H.J., Chiu, C.H., and Lee, J., "Elastic Contact Versus Indentation Modeling of Multilayered Materials," International Journal of Solids and Structures 29(20), 2471–2492, 1992.
Oliver, W.C. and Pharr, G.M., "An Improved Technique for Determining Hardness and Elastic-Modulus Using Load and Displacement Sensing Indentation Experiments," Journal of Materials Research 7(6), 1564–1583, 1992.
Doerner, M.F. and Nix, W.D., "A Method for Interpreting the Data from Depth-Sensing Indentation Instruments," Journal of Materials Research 1(4), 601–609, 1986.
King, R.B., "Elastic Analysis of Some Punch Problems for a Layered Medium," International Journal of Solids and Structures 23, 1657–1664, 1987.
Shield, T.W. and Bogy, D.B., "Some Axisymmetric Problems for Layered Elastic Media: Part I, Multiple Region Contact Solutions for Simply Connected Indenters," Journal of Applied Mechanics 56(4), 798–806, 1989.
Mencik, J., et al., "Determination of Elastic Modulus of Thin Layers Using Nanoindentation," Journal of Materials Research 12(9), 2475–2484, 1997.
Song, H., Selected Mechanical Problems in Load- and Depth-Sensing Indentation Testing, 1999, Rice University: Houston.
Rar, A., Song, H., and Pharr, G.M., "Assessment of New Relation for the Elastic Compliance of a Film-Substrate System," Materials Research Society Symposium Proceedings, 695, 431–436, 2002.
Xu, H. and Pharr, G., "An Improved Relation for the Effective Elastic Compliance of a Film/Substrate System during Indentation by a Flat Cylindrical Punch," Scripta Materialia 55(4), 315–318, 2006.
Bec, S., et al., "Improvements in the Indentation Method with a Surface Force Apparatus," Philosophical Magazine A-Physics of Condensed Matter Structure Defects and Mechanical Properties 74(5), 1061–1072, 1996.
Roche, S., Bec, S., and Loubet, J.L., "Analysis of the Elastic Modulus of a Thin Polymer Film," 778, 117–122,
Hay, J.L., "Measuring Substrate-Independent Modulus of Dielectric Films by Instrumented Indentation," Journal of Materials Research 24(3), 667–677, 2009.
Hay, J.L., "Introduction to Instrumented Indentation Testing," Experimental Techniques 33(6), 66–72, 2009.
Hay, J.L., Agee, P., and Herbert, E.G., "Continuous Stiffness Measurement during Instrumented Indentation Testing," Experimental Techniques 34(3), 86–94, 2010.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2011 Springer Science+Business Media, LLC
About this paper
Cite this paper
Hay, J. (2011). Measuring Substrate-Independent Young’s Modulus of Thin Films. In: Proulx, T. (eds) MEMS and Nanotechnology, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0210-7_7
Download citation
DOI: https://doi.org/10.1007/978-1-4614-0210-7_7
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-0209-1
Online ISBN: 978-1-4614-0210-7
eBook Packages: EngineeringEngineering (R0)