MEMS and Nanotechnology, Volume 4

Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics

  • Tom Proulx

Table of contents

  1. Front Matter
    Pages i-viii
  2. Gokhan Bakan, Niaz Khan, Helena Silva, Ali Gokirmak
    Pages 9-16
  3. Venkat K. Vadlamani, Vijaya B. Chalivendra, Arun Shukla, Sze Yang
    Pages 17-23
  4. L. I. J. C. Bergers, J. P. M. Hoefnagels, E. C. A. Dekkers, M. G. D. Geers
    Pages 25-29
  5. B. C. Prorok, B. Frye, B. Zhou, K. Schwieker
    Pages 39-43
  6. Leming Sun, Vijaya Chalivendra, Paul Calvert
    Pages 59-64
  7. Kaushal K Jha, Nakin Suksawang, Arvind Agarwal
    Pages 65-73
  8. B. Zhou, K. Schwieker, B. Frye, B. C. Prorok
    Pages 75-81
  9. Jan Neggers, Johan Hoefnagels, François Hild, Stéphane Roux, Marc Geers
    Pages 99-103
  10. Matthew E. Jussaume, Peter J. Collins, Ronald A. Coutu Jr.
    Pages 111-118
  11. I. Dobrev, Marc Balboa, Ryan Fossett, C. Furlong, E. J. Harrington
    Pages 119-124
  12. S. Morshed, B. C. Prorok
    Pages 125-130
  13. Hao Su, Michael Zervas, Cosme Furlong, Gregory S. Fischer
    Pages 131-136

About these proceedings

Introduction

MEMS and Nanotechnology represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011.  The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Editors and affiliations

  • Tom Proulx
    • 1
  1. 1.Society for Experimental MechanicsBETHELUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-0210-7
  • Copyright Information The Society for Experimental Mechanics, Inc. 2011
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0209-1
  • Online ISBN 978-1-4614-0210-7
  • Series Print ISSN 2191-5644
  • Series Online ISSN 2191-5652
  • About this book