Materials and Interfaces in Microsystems

  • Tomi Laurila
  • Vesa Vuorinen
  • Toni T. Mattila
  • Markus Turunen
  • Mervi Paulasto-Kröckel
  • Jorma K. Kivilahti
Part of the Microsystems book series (MICT)


The most common stress factors and related failure mechanisms in electronic devices at different interconnection levels are presented. The emphasis is placed on the miniaturised heterogeneous structures of microsystems, which are composed of different types of materials in contact with each other. The interfacial reactions between the materials and their environment are examined from manufacturability, functionality and reliability points of view.


Wafer Bonding Solder Interconnection Fusion Bonding Embed Component Eutectic Bonding 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer-Verlag London 2012

Authors and Affiliations

  • Tomi Laurila
    • 1
  • Vesa Vuorinen
    • 1
  • Toni T. Mattila
    • 1
  • Markus Turunen
    • 1
  • Mervi Paulasto-Kröckel
    • 1
  • Jorma K. Kivilahti
    • 1
  1. 1.School of Electrical EngineeringAalto UniversityEspooFinland

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