Abstract
The most common stress factors and related failure mechanisms in electronic devices at different interconnection levels are presented. The emphasis is placed on the miniaturised heterogeneous structures of microsystems, which are composed of different types of materials in contact with each other. The interfacial reactions between the materials and their environment are examined from manufacturability, functionality and reliability points of view.
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Laurila, T., Vuorinen, V., Mattila, T.T., Turunen, M., Paulasto-Kröckel, M., Kivilahti, J.K. (2012). Materials and Interfaces in Microsystems. In: Interfacial Compatibility in Microelectronics. Microsystems. Springer, London. https://doi.org/10.1007/978-1-4471-2470-2_2
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DOI: https://doi.org/10.1007/978-1-4471-2470-2_2
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