Abstract
The existence of the first structural layer in the PolyMUMPsTM process is specifically for making ground planes, which are necessary to electrically shield devices from the wafer [1–3]. Any two conducting bodies at different potentials will experience an attractive force; this includes surface micromachined devices and the substrate. If the attractive force is strong enough, the device will be pulled down to the substrate surface. Even if the device does not adhere, significant friction will be present.
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© 2004 Kluwer Academic Publishers
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Johnstone, R.W., Parameswaran, M. (2004). Design Techniques. In: An Introduction to Surface-Micromachining. Springer, Boston, MA. https://doi.org/10.1007/978-1-4020-8021-0_8
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DOI: https://doi.org/10.1007/978-1-4020-8021-0_8
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-1077-9
Online ISBN: 978-1-4020-8021-0
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