Skip to main content

Does Copper Undergo Surface Roughening during Fatigue in the VH Regime?

  • Conference paper
Fracture of Nano and Engineering Materials and Structures

Abstract

Extensive studies have been performed on nature and formation of persistent slip bands (PSBs) in the past. They have been identified as sites of localized cyclic plastic deformation, which are typically found in fcc metals, like copper, nickel or solid solutions of these metals. These sites of plastic deformation become visible as extrusions and microcracks (intrusions) on the specimen surface and as “ladder”, “vein” or cell structures of the dislocations in the interior of the specimen. The stresses and plastic strains for their formation are determined by a plateau stress in the cyclic stress strain curve (CSS curves) [1] with a typical plateau stress at approximately 28 MPa and a resolved shear strain between approximately 10−4 and 8×10−3 for copper single crystals. Additional investigations have been performed at stresses below the plateau regime at stresses between 3 and 26 MPa and number of cycles up to several 107 in order to study the evolution of sliding and dislocation characteristics [2]

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

References

  1. H. Mughrabi, Mat. Sci. Eng., 33, 1978, 207–223)

    Article  Google Scholar 

  2. L. Buchinger, S. Stanzl and C. Laird, Phil. Mag. A, 1984, No. 2, 275–298

    Article  Google Scholar 

  3. T. Naita, H. Nueda and M. Kikuchi, Metall. Trans. 15A, 1431–1436

    Google Scholar 

  4. H. Mughrabi, Fatigue Fract. Engng. Mater. Struct. Vol. 22, No. 7, 1999, 633–641

    Article  Google Scholar 

  5. H. Mughrabi, VHCF-3, Proc. Ehird Int. Conf. on VHCF, eds. T. Sakai and Y. Ochi, The Soc. of Mat. Sci., Japan, 2004, 14–18

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2006 Springer

About this paper

Cite this paper

Stanzl-Tschegg, S., Mughrabi, H., Schuller, R. (2006). Does Copper Undergo Surface Roughening during Fatigue in the VH Regime?. In: Gdoutos, E.E. (eds) Fracture of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4972-2_559

Download citation

  • DOI: https://doi.org/10.1007/1-4020-4972-2_559

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-4971-2

  • Online ISBN: 978-1-4020-4972-9

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics