Study on Application of Aluminous Vapor Chamber in Electronic Module Cooling

Abstract

Experiments are performed to study the thermal performance of aluminous vapor chamber to be used for electronic module cooling in this article. The surface temperatures distribution of both solid aluminum and aluminous vapor chamber modules with certain heat flux densities are measured at different ambient temperatures. The equivalent heat conductivity coefficient of the aluminous vapor chamber is obtained by simulation in icepak software, according to the measured surfaces temperatures distribution at different heat fluxes. The results show that the heat conduction ability of the aluminous vapor chamber module is better than solid aluminum module obviously with same sizes. The measured maximum surface temperatures of aluminous vapor chamber module is about 7 ℃ less than that of solid aluminum module at the two different ambient temperatures of 25 ℃ and 50 ℃. The equivalent heat conductivity coefficient of the aluminous vapor chamber increases with an increase in heat flux. The equivalent heat conductivity coefficient reaches 480 W/m k at heat flux 80 W/cm². The weight of aluminous vapor chamber module is only 57% of the solid aluminum module with same sizes. Therefore, the aluminous vapor chamber module is a good replacement for the traditional solid aluminum module with high heat flux.