Abstract
This paper has studied the effects of fasten torque, force distribution and thermal interface materials (TIMs) on the interface thermal resistance between the electronic module package housing and the cold plate. The package housing and the cold plate were fastened by 4 or 6 screws with a reasonable torque ranges from 0.4 N m to 1.0 N m. Five kinds of materials include indium sheet, graphite sheet, elastomeric pad, printable pad and grease were used as TIMs. The test shows that the interface thermal resistance could decrease 20–40% when the torque increases for hard TIMs such as indium sheet, graphite sheet and elastomeric pad with 4 screws, while less than 10% reduction for other soft TIMs. Less reduction of interface thermal resistance was observed with 6 screws. The interface thermal resistances of the five TIMs and direct contact under reasonable pressure and force distribution ranges from large to small with a sequence of graphite sheet, vacuous, indium sheet, elastomeric pad, printable pad and grease. The thermal resistance of printable pad and grease is as low as 1.5 Kcm2/W and insensitive to pressure, which provides a wide application prospect.
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Wei, T., Chen, G., Kong, X., Qian, J. (2020). Experimental Investigation of Interface Thermal Resistance for High Power Electronic Module. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_26
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DOI: https://doi.org/10.1007/978-981-32-9441-7_26
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-32-9440-0
Online ISBN: 978-981-32-9441-7
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