Abstract
The polyethylene insulation material can be affected by thermal factor in the process of manufacture and operation, resulting in irreparable minor structural damage. The damage can distort electric field, which seriously threatens the operation of power grid. In this paper, the thermal properties of self-healing polyethylene insulation composites were analyzed to reduce the damage of thermal factor on the performances of polyethylene. Moreover, the thermal properties of microcapsules with different process ratio and heat treatment were tested. Furthermore, the self-healing performance to physical structural damage was verified by scratch test. The results show that the short-term stability temperature of microcapsule is about 215 °C, and its performance is better when the core-wall ratio is about 0.5. In the long-term thermal environment, the microcapsule can maintain the full morphology below 120 °C and the complete core-wall structure below 180 °C. The damage of thermal factor to microcapsule is mainly reflected in the loss of core material and the rupture of wall structure. Compared with pure polyethylene, the composite has obvious self-healing ability for physical structural damage. Moreover, the thermal decomposition temperature, resistivity and crystallinity of composite are higher, which mainly related to the characteristics of interface between microcapsule and polyethylene. Furthermore, the initial pyrolysis temperature of composite is decreased due to the relatively low thermal stability of microcapsule. In general, the thermal properties of microcapsule can meet the polyethylene application requirements. Moreover, the performances of composite can meet the operation and self-healing requirements of polyethylene insulation material at high temperature.
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The reported research was performed due to the National Natural Science Foundation of China. The contract grant number: 51777018.
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Li, Y., Wang, Y., Zhang, Y., Zhang, Z. (2020). Thermal Properties of Self-healing Polyethylene Insulation Composites Based on Microcapsule System. In: Németh, B. (eds) Proceedings of the 21st International Symposium on High Voltage Engineering. ISH 2019. Lecture Notes in Electrical Engineering, vol 599. Springer, Cham. https://doi.org/10.1007/978-3-030-31680-8_4
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DOI: https://doi.org/10.1007/978-3-030-31680-8_4
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