Abstract
Metals are vital building blocks for MEMS. Pure metals and metal alloys are employed in microsystem design to achieve a wide array of functionality. Common examples include electrical conductors, mechanical structures, magnetic elements, thermal conductors, optical reflectors, and more. In this chapter, additive processes for metals are discussed in the context of their application in MEMS. Particular attention is paid to MEMS-centric processing technologies, where thick metal layers are often required. Basic guidelines are given for material selection, and fabrication recipes are provided as a starting point for process development.
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Notes
- 1.
See Chapter 2 (specifically Section 2.3) for general information on CVD.
- 2.
See Chapters 7 and 8 for more information on chemical etching.
- 3.
See Chapter 9 (specifically Section 9.2.5.5) for more information regarding liftoff.
- 4.
See Chapter 9 for more information on lithography.
- 5.
The German acronym “LIGA” refers to a three-step process: X-ray-Lithography, Electroplating (german: Galvanik), Polymer Replication (German: Abformung). Nowadays, “LIGA” is commonly used in reference to the two-step process of lithography and electroplating (excluding the polymer replication step).
- 6.
See Chapter 13 (specifically Section 13.7) for more information on CMP.
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Arnold, D.P., Saumer, M., Yoon, YK. (2011). Additive Processes for Metals. In: Ghodssi, R., Lin, P. (eds) MEMS Materials and Processes Handbook. MEMS Reference Shelf, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-47318-5_3
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