Overview
- Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as
- the science and modelling of the various mechanisms
- Includes supplementary material: sn.pub/extras
Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 69)
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Table of contents (10 chapters)
Editors and Affiliations
Bibliographic Information
Book Title: Chemical-Mechanical Planarization of Semiconductor Materials
Editors: Michael R. Oliver
Series Title: Springer Series in Materials Science
DOI: https://doi.org/10.1007/978-3-662-06234-0
Publisher: Springer Berlin, Heidelberg
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eBook Packages: Springer Book Archive
Copyright Information: Springer-Verlag Berlin Heidelberg 2004
Hardcover ISBN: 978-3-540-43181-7Published: 26 January 2004
Softcover ISBN: 978-3-642-07738-8Published: 01 December 2010
eBook ISBN: 978-3-662-06234-0Published: 14 March 2013
Series ISSN: 0933-033X
Series E-ISSN: 2196-2812
Edition Number: 1
Number of Pages: XI, 428
Topics: Characterization and Evaluation of Materials, Electronics and Microelectronics, Instrumentation, Manufacturing, Machines, Tools, Processes, Physical Chemistry, Surfaces and Interfaces, Thin Films, Optical and Electronic Materials