Skip to main content
Log in

Activation of melts by the energy of ultrasonic and infrared fields

  • Electrical Processes in Engineering and Chemistry
  • Published:
Surface Engineering and Applied Electrochemistry Aims and scope Submit manuscript

Abstract

The local introduction of ultrasonic vibrations parallel to the processed surface combined with IR heating in melts allows one to concentrate the activation energy in a small volume. This reduces the mechanical action on the processed surfaces, lowers the melt oxidation, and increases the durability of the soldered connections.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. Abramov, O.V., High-Intensity Ultrasonics: Theory and Industrial, Amsterdam: OPA, 1998.

    Google Scholar 

  2. Faridi, H.R., Devletian, J.H., and Le, H.P., New Look at Flux-Free Ultrasonic Soldering, Weld. Journ., 2000, no. 9, pp. 41–45.

  3. Kolenak, R., and Zubor, P., Soldering of Ceramic Materials Using Ultrasonic Energy, Weld. World, 2005, vol. 49, no. 9, pp. 546–553.

    Google Scholar 

  4. Lanin, V.L., Ultrasonic Soldering in Electronics, Ultrason. Sonochem., 2001, no. 8, pp. 379–385.

  5. Zvorykin, D.B., and Prokhorov, Yu.I., Primenenie luchistogo infrakrasnogo nagreva v elektronnoi promyshlennosti (Application of Radiative Infrared Heating in Electronic Industry), M.: Energiya, 1980.

    Google Scholar 

  6. Shutilov, V.A., Osnovy fiziki ul’trazvuka (Fundamentals of Ultrasonic Physics), Leningrad: Izd. Len. Univ., 1980.

    Google Scholar 

  7. Lystrup, A., Measurement of the Ultrasonic Effects in an Ultrasonic Solder Bath, Weld. Journ., 1976, vol. 55, no. 10, pp. 309–313.

    Google Scholar 

  8. Lanin V.L. Cavitation Intensity Investigation at Ultrasonic Soldering, Proc. Conf. Ultrason. Int., Granada (Spain), 2003, pp. 154–156.

  9. Lanin V.L., Ultrasonic Soldering and Tinning in Electronics, Tekhn. Electron. Promyshl., 2009, no. 7, pp. 24–29.

  10. Lanin, V.L., and Bondarik V.M., Electrical Resistance of Soldering Joints at Effect of Ultrasonic Oscillations, Proc. of the 20th Int. Conf. on Electr. Contacts, Stockholm (Sweden), 2000, pp. 205–208.

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to V. L. Lanin.

Additional information

Original Russian Text © V.L. Lanin, 2010, published in Elektronnaya Obrabotka Materialov, 2010, No. 5, pp. 85–92.

About this article

Cite this article

Lanin, V.L. Activation of melts by the energy of ultrasonic and infrared fields. Surf. Engin. Appl.Electrochem. 46, 469–476 (2010). https://doi.org/10.3103/S106837551005011X

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.3103/S106837551005011X

Keywords

Navigation