Abstract
The paper addresses the influence of diamond powder filler on thermal conductivity and adhesive properties of K-300 (K-400) organosilicon epoxy-based glue. The diamond-glue compound is demonstrated to double the rate of cooling of a semiconductor sensor down to cryogenic temperatures and increases sixfold the durability of the glued joint under temperature shock conditions.
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Original Russian Text © V.P. Maslov, 2013, published in Sverkhtverdye Materialy, 2013, Vol. 35, No. 4, pp. 81–84.
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Maslov, V.P. The influence of diamond powder as a filler on properties of a copper-sapphire glued joint. J. Superhard Mater. 35, 256–258 (2013). https://doi.org/10.3103/S1063457613040084
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DOI: https://doi.org/10.3103/S1063457613040084