Abstract
Due to its unique gate-tunable non-volatility, the memtransistor is a promising component for low-energy neuromorphic computing. The grain boundary- and point defect-enabled resistive switching in MoS2 memtransistors suggests an inherent ionizing radiation tolerance. However, the memtransistor resilience under heavy ion irradiation has not yet been investigated. In this work, polycrystalline, monolayer MoS2 films, and memtransistors are irradiated with 48 keV Au. Fluence-dependent effects on the MoS2 lattice structure, chemical states, and memtransistor performance metrics are elucidated. When the Au fluence remains below 1013 cm−2, the memtransistor functionalities are preserved. When the Au fluence exceeds 1014 cm−2, the MoS2 is amorphized and memtransistor functionalities are lost. According to Raman spectroscopy and transmission electron microscopy, the MoS2 defect concentration increases with increasing Au fluence. X-ray photoelectron spectroscopy substantiates a significant S:Mo ratio reduction with increasing Au fluence. This work suggests that MoS2 memtransistors possess sufficient heavy ion resilience for few-year space missions.
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This research was primarily supported by the Laboratory Directed Research and Development Program at Sandia National Laboratories (SNL). This work was performed, in part, at the Center for Integrated Nanotechnologies, an Office of Science User Facility operated for the US Department of Energy (DOE) Office of Science. SNL is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia LLC, a wholly owned subsidiary of Honeywell International Inc. for the US DOE National Nuclear Security Administration under contract DE-NA0003525. This paper describes objective technical results and analysis. Any subjective views or opinions that might be expressed in the paper do not necessarily represent the views of the US DOE or the United States Government. This work also made use of the Northwestern University NUANCE Center and Micro/Nano Fabrication Facility (NUFAB), which has received support from the Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205), the MRSEC program (NSF DMR-1720139) at the Materials Research Center, the International Institute for Nanotechnology (IIN), the Keck Foundation, and the State of Illinois.
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The study was conceived by CMS, SSC, and KH. Materials synthesis and device fabrication were completed by XY, SEL, JY, and MPB. Heavy ion irradiation was performed by EL, NJM, and KH. Materials characterization and corresponding data analysis were performed by CMS, NJM, and PL. Device characterization and corresponding data analysis were performed by JMC. The manuscript was written by CMS and all authors reviewed previous versions of the manuscript. All authors read and approved the final manuscript.
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Smyth, C.M., Cain, J.M., Lang, E.J. et al. Resilience of monolayer MoS2 memtransistor under heavy ion irradiation. Journal of Materials Research 37, 2723–2737 (2022). https://doi.org/10.1557/s43578-022-00642-x
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DOI: https://doi.org/10.1557/s43578-022-00642-x