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Tungsten alloying of the Ni(P) films and the reliability of Sn–3.5Ag/NiWP solder joints

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Abstract

Effects of tungsten (W) addition to the electroless Ni(P) under bump metallization (UBM) on the solder joint reliability were investigated by preparing Ni–xW–5P and Ni–xW–9P films. Characteristics of the NiWP films, interfacial reaction with Sn–3.5Ag solder, and the impact resistance of solder joints was investigated by conducting differential scanning calorimetry, x-ray diffraction, scanning electron microscopy, transmission electron microscopy (TEM), and drop tests. Tungsten increased the thermal stability of the film and raised the crystallization temperature, but the crystallinity decreased with the W content in the film. The drop impact resistance of the Sn–3.5Ag/Ni–xW–9P joints was improved remarkably with the W content in the UBM, which was a direct consequence of the elimination of Ni3Sn4 spalling from the UBM. Additions of W up to 16 wt.% did not suppress intermetallic compound (IMC) spalling completely, but 22 wt.% W did up to 4 reflows, which increased the number of drops to failure (Nf) from 50 to over 300. TEM study showed the presence of an amorphous (Ni,W)3P layer between Ni3Sn4 and the original Ni–22W–9P UBM.

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References

  1. Z. Mei, M. Kauffmann, A. Eslambolchi, and P. Johnson: Brittle interfacial fracture of PBGA packages on electroless Ni/immersion Au, in Proc. 48th Electronic Component and Technology Conference, 952 (1998).

  2. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K.M. Chong, and O. Villalobos: Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (EMIG) interface, in Proc. 52nd Electronic Component and Technology Conference, 732 (2002).

  3. J.Y. Song and J. Yu: Residual stress measurements in electroless plated Ni–P films. Thin Solid Films 415, 167 (2002).

    Article  CAS  Google Scholar 

  4. Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni–P metallization. J. Mater. Res. 19, 2428 (2004).

    Article  CAS  Google Scholar 

  5. Y.C. Sohn and J. Yu: Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection. J. Mater. Res. 20, 1931 (2005).

    Article  CAS  Google Scholar 

  6. M. He, Z. Chen, and G. Qi: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).

    Article  CAS  Google Scholar 

  7. Y.K. Jee, J. Yu, and Y.H. Ko: Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints. J. Mater. Res. 22, 2776 (2007).

    Article  CAS  Google Scholar 

  8. J.F. Li, S.H. Mannan, M.P. Clode, D.C. Whalley, and D.A. Hutt: Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects. Acta Mater. 54, 2907 (2006).

    Article  CAS  Google Scholar 

  9. F. Pearlstein and R.F. Weightman: Electroless deposition of nickel alloys. Electrochem. Technol. 6, 427 (1968).

    CAS  Google Scholar 

  10. G.O. Mallory and T.R. Horhn: Electroless deposition of ternary alloys. Plat. Surf. Finish. 66, 40 (1979).

    CAS  Google Scholar 

  11. J. Hsu and K. Lin: Enhancement in the deposition behavior and deposit properties of electroless Ni–Cu–P. J. Electrochem. Soc. 150, C653 (2003).

    Article  CAS  Google Scholar 

  12. A.F. Schmeckenbecher: Chemical nickel-iron films. J. Electrochem. Soc. 113, 778 (1966).

    Article  CAS  Google Scholar 

  13. T.S.N. Sankara, S. Selvakumar, and A. Stephen: Electroless NiCoP ternary alloy deposits: Preparation and characteristics. Surf. Coat. Technol. 172, 299 (2003).

    Google Scholar 

  14. M. Bouanani, F. Cherkaoui, R. Fratesi, G. Roventi, and G. Barucca: Microstructural characterization and corrosion resistance of Ni–Zn–P alloys electrolessly deposited from a sulphate bath. J. Appl. Electrochem. 29, 637 (1999).

    Article  CAS  Google Scholar 

  15. T. Osaka, N. Kasai, I. Koiwa, and F. Goto: A study on electroless plating of cobalt alloy films for perpendicular recording. J. Electrochem. Soc. 130, 790 (1983).

    Article  CAS  Google Scholar 

  16. K. Chen, C. Liu, D.C. Whalley, and D.A. Hutt: Electroless Ni–W–P alloys as barrier coatings for liquid solder interconnects, in Proc. 1st Electronics System Integration Technology Conference, 421 (2006).

  17. B.D. Cullity and S.R. Stock: Elements of X-ray Diffraction, 3rd ed. (Prentice Hall, NJ, 2001).

    Google Scholar 

  18. T.H. Hentschel, D. Isheim, R. Kirchheim, F. Muller, and H. Kreye: Nanocrystalline Ni–3.6 at.% P and its transformation sequence studied by atom-probe field-ion microscopy. Acta Mater. 48, 933 (2000).

    Article  CAS  Google Scholar 

  19. S.B. Antonelli, T.L. Allen, D.C. Johnson, and V.M. Dubin: Determining the role of W in suppressing crystallization of electroless Ni–W–P films. J. Electrochem. Soc. 153, J46 (2006).

    Article  CAS  Google Scholar 

  20. Y. Yang, Y.J. Lim, A. Kumar, T.K. Lee, and Z. Chen: Interface reactions and shear strength of lead-free Sn–3.5Ag solder with Ni–W–P metallization, in Proc. 9th Electronic Packaging Technology Conference, 527 (2007).

  21. J.Y. Song and J. Yu: A study on residual stresses in electroless Ni(p) and Ni(p)/Sn films. Ph.D. Thesis, Korea Advanced Institute of Science and Technology, Daejeon, South Korea, 2003.

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Acknowledgment

This work was supported by a National Research Foundation of Korea (NRF) grant funded by the South Korean Government (MEST) (Grant No. 2010-0000862).

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Korea Advanced Institute of Science & Technology (KAIST), Electronic Packaging Laboratory, Yuseong-gu, Daejeon, 305-701, Korea

    Dong Min Jang & Jin Yu

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  1. Dong Min Jang
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  2. Jin Yu
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Jang, D.M., Yu, J. Tungsten alloying of the Ni(P) films and the reliability of Sn–3.5Ag/NiWP solder joints. Journal of Materials Research 26, 889–895 (2011). https://doi.org/10.1557/jmr.2011.17

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